2006
DOI: 10.1016/j.tsf.2005.09.026
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Atomic layer deposition and post-deposition annealing of PbTiO3 thin films

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Cited by 46 publications
(36 citation statements)
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“…EDS mapping shows that cracks are through total film thickness, until the Si substrate. This crack indicate that high stress exists in thin film due to lattice mismatch between the film (PbTiO 3 ) and (Si) substrate on cooling [15].…”
Section: Resultsmentioning
confidence: 96%
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“…EDS mapping shows that cracks are through total film thickness, until the Si substrate. This crack indicate that high stress exists in thin film due to lattice mismatch between the film (PbTiO 3 ) and (Si) substrate on cooling [15].…”
Section: Resultsmentioning
confidence: 96%
“…As it was mentioned above the annealing atmosphere content (N 2 , O 2 [15], Ar [20]) and pressure [17] have impact on the solid state reaction and oxidation rate and therefore the surface morphology. Annealing in vacuum was chosen to slow down the oxidation rate and to form PbTiO 3 tetragonal phase by solid state reactions between mixed (PbO and TiO 2 ) phases in thin films without influence of oxygen from environment.…”
Section: Resultsmentioning
confidence: 97%
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“…The self-regulated growth of PbO and TiOx films has already been confirmed [5,6]. Although there are several papers on the ALD of ternary oxide thin films including PbTiOx [6][7][8], the challenge of quaternary oxide deposition by combining three binary ALD processes can hardly be found in the literature.…”
Section: Introductionmentioning
confidence: 99%