Atomic Layer Deposition for Thin Film Solid-State Battery and Capacitor

Go, Dohyun; Shin, Jeong Woo; Lee, Seunghyeon; Lee, Jaehyeong; Yang, Byung Chan; Won, Yoonjin; Motoyama, Munekazu; An, Jihwan

doi:10.1007/s40684-022-00419-x

Cited by 7 publications

(2 citation statements)

References 105 publications

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“…[179,[181][182][183][184][185][186][187][188][189][190][191] Several remarkable reviews primarily concentrated on ALD-based electrode materials for rechargeable batteries. [192][193][194][195][196][197][198][199][200][201][202][203][204][205] Among these, several notable reviews have been primarily dedicated to exploring ALD-based electrode materials in the context of rechargeable batteries. Such investigations are crucial in our pursuit of improved energy storage solutions, and these comprehensive analyses have significantly advanced our understanding in this area.…”

Section: Ald Applications For Scsmentioning

confidence: 99%

Atomic Layer Deposition—A Versatile Toolbox for Designing/Engineering Electrodes for Advanced Supercapacitors

Ansari,

Hussain,

Mohapatra

et al. 2023

Advanced Science

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Atomic layer deposition (ALD) has become the most widely used thin‐film deposition technique in various fields due to its unique advantages, such as self‐terminating growth, precise thickness control, and excellent deposition quality. In the energy storage domain, ALD has shown great potential for supercapacitors (SCs) by enabling the construction and surface engineering of novel electrode materials. This review aims to present a comprehensive outlook on the development, achievements, and design of advanced electrodes involving the application of ALD for realizing high‐performance SCs to date, as organized in several sections of this paper. Specifically, this review focuses on understanding the influence of ALD parameters on the electrochemical performance and discusses the ALD of nanostructured electrochemically active electrode materials on various templates for SCs.It examines the influence of ALD parameters on electrochemical performance and highlights ALD's role in passivating electrodes and creating 3D nanoarchitectures. The relationship between synthesis procedures and SC properties is analyzed to guide future research in preparing materials for various applications. Finally, it is concluded by suggesting the directions and scope of future research and development to further leverage the unique advantages of ALD for fabricating new materials and harness the unexplored opportunities in the fabrication of advanced‐generation SCs.

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Section: Ald Applications For Scsmentioning

confidence: 99%

Atomic Layer Deposition—A Versatile Toolbox for Designing/Engineering Electrodes for Advanced Supercapacitors

Ansari,

Hussain,

Mohapatra

et al. 2023

Advanced Science

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“…Electrostatic or dielectric capacitors are drawing much interest for use in electronic circuits and electromagnetic devices owing to their fast charge/discharge rates and high power densities. − High- k thin films are essential components of thin film electrostatic capacitors and can significantly improve the energy and power densities of their bulk counterparts. Titanium oxide (TiO 2 ) is one of the most interesting high- k materials in such applications owing to its extremely high dielectric constant, which is associated with crystallinity and phase; for example, the rutile-TiO 2 film is well-known for its higher dielectric constant (90–170) than amorphous (<30) and anatase-TiO 2 (30–75). − However, the relatively low energy band gap ( E g of 3.2 eV) of TiO 2 films at the expense of such high permittivity often necessitates lamination with lower- k /higher- E g (e.g., SiO 2 and Al 2 O 3 ) films.…”

Section: Introductionmentioning

confidence: 99%

High-Performance TiO₂/ZrO₂/TiO₂ Thin Film Capacitor by Plasma-Assisted Atomic Layer Annealing

Lee,

Han,

Kim

et al. 2024

ACS Appl. Mater. Interfaces

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Although laminate structures are widely used in electrostatic capacitors, unavoidable heterogeneous interfaces often deteriorate the dielectric properties by impeding film crystallization. In this study, a TiO 2 /ZrO 2 /TiO 2 (TZT) laminate structure, where upper-TiO 2 deposited on the heterogeneous interface was crystallized by plasma-assisted atomic layer annealing (ALA), was investigated. ALA effectively induced the phase transition of the upper-TiO 2 from the amorphous or anatase phase to the rutile phase, leading to an increase in the dielectric constant, whereas the ZrO 2 blocking interlayer maintained the amorphous phase owing to the extremely localized effect of ALA. Consequently, through the layer-by-layer phase control of ALA, the dielectric constant of the upper-TiO 2 was enhanced by 25% by applying ALA, leading to an increase in a capacitance density of 27% of the TZT capacitor, whereas a low leakage current density of ∼10 −8 A/cm 2 was maintained (at 1 V). In addition, the TZT capacitor on threedimensional structures (aspect ratio of 5:1) shows a high capacitance density of up to 461 nF/mm 2 owing to ALA.

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Cost-Effective and Environmentally Friendly Mass Manufacturing of Optical Metasurfaces Towards Practical Applications and Commercialization

Seong,

Jeon,

Yang

et al. 2023

Int. J. of Precis. Eng. and Manuf.-Green Tech.

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Optical metasurfaces consisting of two-dimensional nanostructures have rapidly developed over the past two decades thanks to their potential for use as optical components, such as metalenses or metaholograms, with ultra-compact form factors. Despite these rapid developments, major challenges for the commercialization of metasurfaces still remain: namely their mass production and use in real-life devices. A lot of effort has been made to overcome the limitations of electron beam lithography which is commonly used to fabricate metasurfaces. However, a breakthrough in mass production is still required to bring the cost of metasurfaces down into the price range of conventional optics. This review covers deep-ultraviolet lithography, nanoimprint lithography, and self-assembly-based fabrication processes that have the potential for the mass production of both cost-effective and environmentally friendly metasurfaces. We then discuss metalenses and future displays/sensors that are expected to take advantage of these mass-produced metasurfaces. The potential applications of mass-produced optical metasurfaces will open a new realm for their practical applications and commercialization.

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Atomic Layer Deposition for Thin Film Solid-State Battery and Capacitor

Cited by 7 publications

References 105 publications

Atomic Layer Deposition—A Versatile Toolbox for Designing/Engineering Electrodes for Advanced Supercapacitors

Atomic Layer Deposition—A Versatile Toolbox for Designing/Engineering Electrodes for Advanced Supercapacitors

High-Performance TiO₂/ZrO₂/TiO₂ Thin Film Capacitor by Plasma-Assisted Atomic Layer Annealing

Cost-Effective and Environmentally Friendly Mass Manufacturing of Optical Metasurfaces Towards Practical Applications and Commercialization

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Atomic Layer Deposition for Thin Film Solid-State Battery and Capacitor

Cited by 7 publications

References 105 publications

Atomic Layer Deposition—A Versatile Toolbox for Designing/Engineering Electrodes for Advanced Supercapacitors

Atomic Layer Deposition—A Versatile Toolbox for Designing/Engineering Electrodes for Advanced Supercapacitors

High-Performance TiO2/ZrO2/TiO2 Thin Film Capacitor by Plasma-Assisted Atomic Layer Annealing

Cost-Effective and Environmentally Friendly Mass Manufacturing of Optical Metasurfaces Towards Practical Applications and Commercialization

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High-Performance TiO₂/ZrO₂/TiO₂ Thin Film Capacitor by Plasma-Assisted Atomic Layer Annealing