Vanadium dioxide (VO2) thin films were deposited by atomic layer deposition (ALD) using tetrakis(ethylmethylamino) vanadium precursor and H2O oxidant at a temperature of 150 °C. Optimization of post-deposition annealing results in smooth, continuous VO2 films (thickness, t ~ 30 nm) with small grains, exhibiting a transition from semiconducting to metal phase, typically known as the metal-insulator transition (MIT), at ~ 72 °C with a switching ratio ~ 10 2 . Such films were produced with high repeatability on a wafer scale and have been successfully utilized in resistively-coupled oscillators and self-selected resistive devices.Under smaller process window, thin films (t ~ 30 nm) with very large grains have also been produced, exhibiting the MIT ratio ~ 10 3 , which is the highest achieved for the ALD VO2 films deposited on SiO2 substrates. Both types of films were characterized again after 120 days to access their stability in air, a property that was rarely investigated.