Atomic layer deposition (ALD) is a key coating technology which enables conformal coatings on high aspect ratio substrates. In addition, it allows for a precise thickness control of thin films, multilayers, and nanolaminates. It is a chemical coating technology where the precursors are introduced sequentially in the reactor or are spatially separated. Herein, basic principles of ALD are introduced, reactor geometries are overviewed, and typical ALD materials and applications are summarized. ALD thin films are one pillar of modern computer technologies where ultra‐thin, conformal coatings with exceptional physical, electrical, and chemical properties are essential. Numerous emerging applications have been demonstrated and some are already in mass‐production. Precursor and process development, tool design and engineering, extensive thin‐film optimization, the search for better materials and composites combined with expert knowledge in the application fields have led to this success.