2018
DOI: 10.1002/advs.201800096
|View full text |Cite
|
Sign up to set email alerts
|

Atomic Scale Modulation of Self‐Rectifying Resistive Switching by Interfacial Defects

Abstract: Higher memory density and faster computational performance of resistive switching cells require reliable array‐accessible architecture. However, selecting a designated cell within a crossbar array without interference from sneak path currents through neighboring cells is a general problem. Here, a highly doped n++ Si as the bottom electrode with Ni‐electrode/HfOx/SiO2 asymmetric self‐rectifying resistive switching device is fabricated. The interfacial defects in the HfOx/SiO2 junction and n++ Si substrate resu… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
19
0

Year Published

2018
2018
2024
2024

Publication Types

Select...
8

Relationship

3
5

Authors

Journals

citations
Cited by 31 publications
(19 citation statements)
references
References 33 publications
0
19
0
Order By: Relevance
“…[11,35] It should be noted that the self-rectifying feature of memristors is crucial for overcoming the crosstalk problems in crosspoint array structures. [36][37][38] Let us directly demonstrate the effect of the self-rectifying characteristics of Device 2 on the crosstalk problems in the crosspoint structure. We fabricated a prototype array of 2 × 2 Device 2 (see Figure S6, Supporting Information) and performed the actual addressing test in the worst-case scenario in which the cells near the selected device were set to the LRS (case 2 in Figure S7, Supporting Information).…”
Section: Resultsmentioning
confidence: 99%
“…[11,35] It should be noted that the self-rectifying feature of memristors is crucial for overcoming the crosstalk problems in crosspoint array structures. [36][37][38] Let us directly demonstrate the effect of the self-rectifying characteristics of Device 2 on the crosstalk problems in the crosspoint structure. We fabricated a prototype array of 2 × 2 Device 2 (see Figure S6, Supporting Information) and performed the actual addressing test in the worst-case scenario in which the cells near the selected device were set to the LRS (case 2 in Figure S7, Supporting Information).…”
Section: Resultsmentioning
confidence: 99%
“…Figure A,B show the location of Er dopant within MoS 2 by high‐angle annular dark field scanning transmission electron microscopy (HAADF‐STEM) with the correction of spherical (CS) aberration. Because the HAADF intensity is proportional to the atomic number (Z), and Er has a larger atomic number ( Z = 68) than S ( Z = 14) and Mo ( Z = 42), Er atom, can be easily recognized for its stronger intensity in HAADF‐STEM images . To study the structural characterization, the PL spectra of prepared MoS 2 :Er samples have been further measured.…”
Section: Doping Defectsmentioning
confidence: 88%
“…Because the HAADF intensity is proportional to the atomic number (Z), and Er has a larger atomic number (Z = 68) than S (Z = 14) and Mo (Z = 42), Er atom, can be easily recognized for its stronger intensity in HAADF-STEM images. 84 To study the structural characterization, the PL spectra of prepared MoS 2 :Er samples have been further measured. Figure 2C shows PL spectra of the bilayer MoS 2 :Er samples under 488 nm (2.58 eV which is larger than the band gap of 2D MoS 2 ) excitation.…”
Section: Doping Defectsmentioning
confidence: 99%
“…Since the successful preparation of graphene, the employment of 2D materials has become a possibility, triggering a boom in the study of 2D materials. The continuous improvement of 2D material preparation technology [7] and manipulation of materials at the atomic scale [57,58], have greatly promoted the development of 2D materials and 2D devices [59,60,61,62]. 2D materials are widely applied in nanoelectronics and optoelectronics due to their outstanding optical, electronic, and other physical properties [63].…”
Section: Thermoelectric and 2d Materialsmentioning
confidence: 99%