Atomic Simulations of Deformation Mechanism of 3C-SiC Polishing Process with a Rolling Abrasive

Yin, Zhihua; Zhu, Pengzhe; Li, Baozhen; Xu, Yimeng; Li, Rao

doi:10.1007/s11249-021-01526-7

Cited by 12 publications

(4 citation statements)

References 64 publications

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“…This is due to the strong compression of the workpiece atoms in the machined region due to the high stresses generated between the tool and the workpiece during the cutting process in these three crystal orientations. This leads to a change in the initial atomic structure of the workpiece, with most of it transforming into an amorphous structure and a few atoms transforming into a hexagonal diamond structure, as also observed in the study by Yin et al 22 In addition, when machining (111) surface, vacancy atom defects were also observed below the machining area, which will adversely affect the quality and mechanical properties of the machined surface.…”

Section: Chip Morphology and Subsurface Damagementioning

confidence: 55%

Influence of crystallographic effect on tool wear, cutting stress, cutting temperature, cutting force and subsurface damage in nano cutting of single crystal silicon carbide

Chen

Pan

et al. 2023

Proceedings of the Institution of Mechanical Engineers, Part C:

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Single crystal 3C-SiC as a typical hard and brittle material. Due to its extremely high hardness and brittleness, diamond tools can have drastic wear problems in a short period of time when performing nano-machining processes. Single-crystal 3C-SiC has good anisotropy. In order to gain insight into the effect of crystal orientation on the tool wear behavior during nano-cutting, this paper investigated the tool wear for six cutting crystals downward using molecular dynamics simulation. The tool wear process was analyzed in terms of tool wear, cutting stress, cutting temperature, cutting force and subsurface damage. The results showed that the tool is subjected to large hydrostatic stress concentrations, radial forces and tool temperature concentrations during machining. Under these effects, abrasive wear, graphitic wear and amorphous phase change were produced. In addition, the clearance face of the tool is more severely worn than the rake face. By reasonably selecting the cutting crystal orientation, well control and improvement of tool wear and machined surface quality can be achieved.

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Section: Chip Morphology and Subsurface Damagementioning

confidence: 55%

Influence of crystallographic effect on tool wear, cutting stress, cutting temperature, cutting force and subsurface damage in nano cutting of single crystal silicon carbide

Chen

Pan

et al. 2023

Proceedings of the Institution of Mechanical Engineers, Part C:

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“…The defects formed in this area are fully expanded and easy to form irreversible structural phase transitions, thereby affecting the number of defective atoms. In addition, the cutting movement of the tool makes the disordered movement of atoms in highly stressed workpieces more intense, increasing the number of stacked atoms, further exacerbating the evolution of atomic structural phase transitions within the workpiece [49]. Therefore, the greater the cutting depth, the more severely the intact FCC structure inside the copper-nickel alloy workpiece is destroyed, and the more atoms are formed in amorphous, HCP structure and BCC structure.…”

Section: Effect Of Nano-cutting Depths On Damage Evolutionmentioning

confidence: 99%

Study on the atomic removal behavior and damage formation mechanism of nano cutting copper–nickel alloy with diamond tool

He,

Gao,

Tang

et al. 2024

Modelling Simul. Mater. Sci. Eng.

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The effects of tool rake angle and cutting depth on cutting temperature, cutting force, friction coefficient of rake tool face, atomic accumulation of chip flow and removal, surface quality, sub-surface damage layer thickness, atomic stress, and dislocation evolution were studied by molecular dynamics simulations. The results showed that the cutting temperature was concentrated on the chip, and the chip was easy to flow out with the increase of the tool rake angle, which weakens the extrusion and shearing action of the workpiece, resulting in the gradual reduction of tangential force. The tool rake angle of 10° is beneficial to improve the surface/subsurface quality of the workpiece. The minimum root-mean-square roughness obtained was 0.73 Å. The atomic stress of the workpiece was mainly concentrated around the area of interaction with the tool, and the atoms on the finished surface underwent elastic recovery, so the atomic stress was not significant. The 1/6<112> (Shockley) dislocation density had always been in the leading position, and 1/6<112> (Shockley) dislocation was continuously synthesized and decomposed during the nano-cutting process. With the increase of cutting depth, the number of atoms removed increases rapidly, and the width of chip side flow increases, but the symmetry is weakened. The contour line map even shows deep wave valleys caused by the absence of atoms, which increases the surface roughness. Moreover, the area and depth of the atomic stress distribution in the subsurface layer increase, and the number of amorphous atoms and dislocation density increase.

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“…The MD simulation studies of materials are widely used to investigate the mechanical behavior and deformation mechanisms of materials at the nanoscale. It has been widely applied in the study of atomic-scale surface deformation and crystal structure and is suitable for the study of properties that are difficult to measure with many traditional experimental methods [ 27 , 28 , 29 , 30 , 31 ]. Li et al [ 32 ] employed molecular dynamics simulations to investigate the influence of cracking on GaAs deformation in different crystal orientations during processing.…”

Section: Introductionmentioning

confidence: 99%

Investigation of Gallium Arsenide Deformation Anisotropy during Nanopolishing via Molecular Dynamics Simulation

Zhao,

Gao,

Pan

et al. 2024

Micromachines

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Crystal orientation significantly influences deformation during nanopolishing due to crystal anisotropy. In this work, molecular dynamics (MD) simulations were employed to examine the process of surface generation and subsurface damage. We conducted analyses of surface morphology, mechanical response, and amorphization in various crystal orientations to elucidate the impact of crystal orientation on deformation and amorphization severity. Additionally, we investigated the concentration of residual stress and temperature. This work unveils the underlying deformation mechanism and enhances our comprehension of the anisotropic deformation in gallium arsenide during the nanogrinding process.

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Atomic Simulations of Deformation Mechanism of 3C-SiC Polishing Process with a Rolling Abrasive

Cited by 12 publications

References 64 publications

Influence of crystallographic effect on tool wear, cutting stress, cutting temperature, cutting force and subsurface damage in nano cutting of single crystal silicon carbide

Influence of crystallographic effect on tool wear, cutting stress, cutting temperature, cutting force and subsurface damage in nano cutting of single crystal silicon carbide

Study on the atomic removal behavior and damage formation mechanism of nano cutting copper–nickel alloy with diamond tool

Investigation of Gallium Arsenide Deformation Anisotropy during Nanopolishing via Molecular Dynamics Simulation

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