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Gray, J. M.

doi:10.1007/bf02645625

Cited by 1 publication

(1 citation statement)

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“…Until recently, most research into solder has dealt with the effects of thermal fatigue and ageing [6], and that which has dealt with the strain rate sensitivity of the material was mainly concerned with quasistatic or creep behaviour [7][8][9][10][11][12][13][14][15][16][17][18][19][20][21][22][23]. However, the increase in use of mobile telephones and computers means that solder joints are regularly loaded 1 Author to whom any correspondence should be addressed.…”

Section: Introductionmentioning

confidence: 99%

Rate dependent strengths of some solder joints

Williamson¹,

Field²,

Palmer³

et al. 2007

J. Phys. D: Appl. Phys.

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The shear strengths of three lead-free solder joints have been measured over the range of loading rates 10−3 to ∼105 mm min−1. Binary (SnAg), ternary (SnAgCu) and quaternary (Castin: SnAgCuSb) alloys have been compared to a conventional binary SnPb solder alloy. Results show that at loading rates from 10−3 to 102 mm min−1, all four materials exhibit a linear relationship between the shear strength and the loading rate when the data are plotted on a log–log plot. At the highest loading rate of 105 mm min−1, the strengths of the binary alloys were in agreement with extrapolations made from the lower loading rate data. In contrast, the strengths of the higher order alloys were found to be significantly lower than those predicted by extrapolation. This is explained by a change in failure mechanism on the part of the higher order alloys. Similar behaviour was found in measurements of the tensile strengths of solder joints using a novel high-rate loading tensile test. Optical and electron microscopy were used to examine the microstructures of interest in conjunction with energy dispersive x-ray analysis for elemental identification. The effect of artificial aging and reflow of the solder joints is also reported.

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