Automated Modeling and Fatigue Analysis of Flexible Printed Circuits

Ptchelintsev, Alexander

doi:10.1109/esime.2006.1643955

Cited by 9 publications

(5 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…With the trend moving towards lightweight, thin, bendable and portable electronic products, flexible display is expected to lead the future development of the display industries. Based on market requirement trends that favour Amazon's Kindle, flexible and thinner components are progressively replacing the rigid and thicker alternatives, particularly printed circuit and flexible display (Ptchelintsev, 2006). If a display can be bent easily, then a large image can be enjoyed anywhere, and it can also be carried anywhere and be accessible at any time.…”

Section: Benefits Of E-papermentioning

confidence: 99%

Foresight for E-paper development in Taiwan

Hsieh

Lin

Huang

2017

View full text Add to dashboard Cite

Purpose This study aims to analyse the impact of e-paper on many existing industries including paper, publishing, book distribution, display, handheld device manufacturers and content service providers. Flexible display has been studied by many institutes, firms and market research companies. Some believe that e-paper is an exceptional application for flexible display, and the need for flexible display development for handheld devices and cloud-based e-book content is indisputable. Design/methodology/approach This study uses the Delphi technique and STEEP (Sociological, Technological, Economic, Environmental and Political aspects) with a panel to analyse a business model and the opportunity for the development of e-paper in Taiwan up to the year 2020. Findings The study concludes that e-paper content and customised digital services are an essential part of e-paper development, while hardware and cloud data are no more than a mechanism to show, compute and store data. Thus, whether the screen of a handheld device is flexible may not be of importance. Although e-paper will affect the display industry, it will not substitute for handheld devices and traditional bookstores. Originality/value This research can be used as a reference for government, academics, industry and international investors.

show abstract

Section: Benefits Of E-papermentioning

confidence: 99%

Foresight for E-paper development in Taiwan

Hsieh

Lin

Huang

2017

View full text Add to dashboard Cite

show abstract

“…Because of the rigid property of rigid PCBs, the range of the bending angles is very limited. Alexander Ptchelintsev [8] has also presented a methodology to study the FPCs under extreme loading conditions. Various FPCs were bent to different radii by moving one end of the FPC while the other end of the FPC was fixed to a rigid plane.…”

Section: Introductionmentioning

confidence: 99%

“…In this paper, based on the methodologies in publication [7] and [8], the simulation models are built to simulation a BGA mounted on the FPC. The length of the FPC, the height of the solder joints, and the diameter of the solder joints will be taken as driven parameters.…”

Section: Introductionmentioning

confidence: 99%

Prediction of bending reliability of BGA solder joints on Flexible Printed Circuit (FPC)

Huang

Chen

et al. 2009

2009 International Conference on Electronic Packaging Technology &Amp; High Density Packaging

View full text Add to dashboard Cite

In this paper, the mechanical performance of solder joints of BGA mounted on flexible printed circuit (FPC) was studied using finite element method (FEM). To optimize the electric components layout during the design, it is necessary to predict the bending reliability of components on FPC. Traditionally, 3-point or 4-point bending are common used to study if the substrate is rigid. In order to simulate the free bending condition with soft substrate, a new bending method is taken. That's to fix the FPC at one side and move the other side to bend the FPC. Based on this novel model, the length of the FPC, the height and diameter of the solder joints are respectively taken as the optimized variables. With the variable change, there are many different cases. For one general case, the bending process is divided into two steps. At first, to rotate the FPC about 180° at one side and make the two fixtures parallel; then move the fixture to control the bending. It is found that the stress of the solder joints in first step linearly proportioned increase with the bending. While in the second step, the stress reaches the peak and declines gradually with the two ends of the FPC get closer. Simulation results indicate that by using the longer FPC can improve the reliability significantly. Normally, reliability can be also improved by increasing the height and diameter of the solder joints. While in the translating-induced bending, increasing the diameter will worsen the solder reliability unless the diameter is larger than 0.3mm.

show abstract

“…The needs of multifunctional components in electronic industry encourage researchers to improve several features such as low resistance interconnects, high electrical conductivity [1,2,3,4] and develop new formulation for coating [5] to enhance performance and reduce cost maintenance. However, electronic devices in real application will be exposed directly on corrosion element such as air, moisture and corrosive environment.…”

Section: Introductionmentioning

confidence: 99%