Automated solvent vapor annealing with nanometer scale control of film swelling for block copolymer thin films

Abstract

Molecular self-assembly of block copolymers has been pursued as a next generation high-resolution, low-cost lithography technique. Solvent vapor annealing is a promising way of achieving self-assembled patterns from polymers with high interaction parameters, w, or high molecular weights. Compared to thermal annealing, the assembly in a solvated state can be much faster, but the film swelling process is typically challenging to control and reproduce. We report the design and implementation of an automated solvent annealing system that addresses these issues. In this system the film swelling is controlled via local heating or cooling, which enables exceptionally fast and precise modulation of the swelling. The swelling of the polymer films follows preprogrammed annealing profiles with the help of a feedback loop that compares and tunes the film thickness with respect to the set point. The system therefore enables complex annealing profiles such as rapid cyclic swelling and deswelling. We show that the orientation of the pattern morphology and the amount of lattice defects are influenced by the used annealing profile. We demonstrate that optimized profiles significantly shorten the annealing time (o15 min) of high-w and high-molecular weight poly(styrene-b-2-vinylpyridine).

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“…A standardised methodology for polymer based lithographic techniques that has effective defect control, effective pattern transfer and flexible nanopatterning is critical [ 10 , 138 ]. Defect mitigation and repair techniques are under development as they are simple, consisting of basic apparatus for pressure and temperature control [ 123 , 124 ].…”

“…Nitrogen is a favourable alternative to CVD as securing stable helium supplies become increasingly short in supply [ 161 ]. CVD systems involved in DSA currently are modelled on Nitrogen carrier gases [ 123 ].…”

“…Ionic liquids (ILs) can also be environmentally friendly if chosen carefully [122]. Development of an industrial SVA system that is fast and precise, with potential for wafer scale processing, will help facilitate the transition of this technology from the research scale to the industrial [123][124][125]. Annealing chambers with temperature and gas flow systems facilitate thickness and pattern formation control [124,125].…”

“…Annealing chambers with temperature and gas flow systems facilitate thickness and pattern formation control [124,125]. BCP patterns of 5 to 200 nm size range with dot, line hole or lamellar patterns have a predicted use in HMV (High volume manufacturing) in 2022 in device type: 3 nm node logic [16,123,126]. an industrial SVA system that is fast and precise, with potential for wafer scale processing, will help facilitate the transition of this technology from the research scale to the industrial [123][124][125].…”

“…BCP patterns of 5 to 200 nm size range with dot, line hole or lamellar patterns have a predicted use in HMV (High volume manufacturing) in 2022 in device type: 3 nm node logic [16,123,126]. an industrial SVA system that is fast and precise, with potential for wafer scale processing, will help facilitate the transition of this technology from the research scale to the industrial [123][124][125]. Annealing chambers with temperature and gas flow systems facilitate thickness and pattern formation control [124,125].…”