Automatic calibration of detailed IC package models

Abstract

Structure function based simulation model calibration has become common in the electronics cooling industry. Verifying that a model can produce a simulated structure function curve that matches an experimental structure function is valuable to the analyst, as it confirms the simulation model will respond correctly to any power stimulus for a particular application. Structure function based model calibration has typically been a manual process and required a high level of domain knowledge to be successful. The present work introduces a method to reduce structure function based calibration into an optimization problem and discusses the associated work flow.

Parametric Models of Thermal Transfer Impedances within a Successive Node Reduction Based Thermal Simulation Environment

“…For a given IC package the DELPHI compact modeling methodology uses a global optimization method to find the network element values of the fixed DELPHI model topology which fit the simulation results for a great variety of different thermal boundary conditions obtained by CFD simulations (using the detailed geometrical model of the package) the best 1 . Nowadays such detailed simulation models are validated or even automatically calibrated against physical measurement results using the method of structure function analysis [5].…”