Automatic fabrication system for plastic microfluidic chips

Wang, Xiao Dong; Wang, Liding; Liu, Chong; Ma, Liqun; Luo, Yuling

doi:10.1109/mhs.2004.1421270

Cited by 2 publications

(1 citation statement)

References 3 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Micro-channel which as the core structure of the microfluidic chip directly determines the application scope of the chip. Micro-channel is often manufactured by using molding or pressing [1]. Nowadays, micro-channel mold is fabricated mainly by silicon dry and wet etching technology, photoresist technology and lithography electroforming injection of Ni mold (LIGA) or ultraviolet lithography electroforming injection (UV-LIGA)[2~4], but these techniques have very high requirements for equipment, complex production process, a longer period (more than 10 h) and high costs.…”

Section: Introductionmentioning

confidence: 99%

Micro-Channel Mold Machined by Ultrafine WEDM

Wang

Chen

Zhu

et al. 2014

AMR

View full text Add to dashboard Cite

In this study, an ultrafine WEDM (wire electrical discharge machining) of micro-channel mold is proposed. It could be divided into two parts, rough machining and finish processing. In rough machining procedure, high machining voltage is adopted to improve machining efficiency. In finish machining procedure, extended and trimmed tool path is adopted to obtain the cusp at the corner, low electrical parameters is adopted to improve surface quality and dimensional precision. By conducting finish machining of 40V, a better surface-quality with Ra of 0.32μm and high aspect ratio of 20:1 was fabricated.

show abstract

Section: Introductionmentioning

confidence: 99%

Micro-Channel Mold Machined by Ultrafine WEDM

Wang

Chen

Zhu

et al. 2014

AMR

View full text Add to dashboard Cite

show abstract

Development of a Low-Cost, Rapid-Cycle Hot Embossing System for Microscale Parts

Hale

Hardt

2008

Volume 13: Nano-Manufacturing Technology; And Micro and Nano Systems, Parts a and B

View full text Add to dashboard Cite

Hot embossing is an effective technology for reproducing micro-scale features in polymeric materials, but large-scale adoption of this method is hindered by high capital costs and low cycle times relative to other technologies, and a general lack of manufacturing equipment. This work details a hot embossing machine design strategy motivated by maximum production speed and quality with minimal capital cost. The approach is to "right-size" the machine for specific product needs while making the design flexible and scalable. Toward this end, a minimal number of components were used, commercially available off-the-shelf components were chosen where possible, system layout was designed to be modular, and system size was scaled for the intended products (in this case microfluidic devices). Innovative design aspects include the use of new ceramic substrate heaters for electrical heating, use of a moveable heat sink to minimize heat load during the heating cycle, and the careful design of the thermal elements to minimize the heating and cooling cycle times. The capital cost and the cost per part produced with this machine are estimated to be an order of magnitude less than currently available hot embossing manufacturing options. The hot embossing machine has been tested extensively to characterize the process variability. The minimum cycle time is two minutes, and microstructures are replicated within a maximum of a 25mm by 75mm area with very low relative variance in dimensions.

show abstract

Automatic fabrication system for plastic microfluidic chips

Cited by 2 publications

References 3 publications

Micro-Channel Mold Machined by Ultrafine WEDM

Micro-Channel Mold Machined by Ultrafine WEDM

Development of a Low-Cost, Rapid-Cycle Hot Embossing System for Microscale Parts

Contact Info

Product

Resources

About