Autonomic healing of PMMA via microencapsulated solvent

Celestine, Asha‐Dee N.; Sottos, Nancy R.; White, Scott R.

doi:10.1016/j.polymer.2015.03.072

Cited by 31 publications

(24 citation statements)

References 46 publications

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“…The high boiling point and immiscibility of anisole with water also allows it to be easily encapsulated using in situ polymerization of urea-formaldehyde in an oil-in-water emulsion 21 . Importantly, anisole has been shown to be a suitable solvent for solvent welding based self-healing in PMMA 22,23 which contains methacrylate functionalities commonly found in most commercially available SL 3DP resins. Anisole was therefore expected to also be a good candidate for healing photocured SL 3DP resins and preliminary testing showed that anisole could soften and increase tackiness of surfaces in such photocured samples.…”

Section: Resultsmentioning

confidence: 99%

Stereolithographic 3D printing of extrinsically self-healing composites

Sanders

Young

Qin

et al. 2019

Sci Rep

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We demonstrate for the first time the direct stereolithographic 3D printing of an extrinsically self-healing composite, comprised of commercial photocurable resin modified with anisole and PMMA-filled microcapsules. The composites demonstrate solvent-welding based autonomous self-healing to afford 87% recovery of the initial critical toughness. This work illustrates the potential of stereolithographic printing to fabricate self-healing composites with user-defined structures, avoiding the need for extensive rheological optimization of printing inks, like in direct-write 3D printing. Importantly, this work also demonstrates the inclusion of microcapsules into 3D printing resins to incorporate additional functionality into printed composites, which could be adapted for applications beyond self-healing materials.

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Section: Resultsmentioning

confidence: 99%

Stereolithographic 3D printing of extrinsically self-healing composites

Sanders

Young

Qin

et al. 2019

Sci Rep

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“…In addition, incorporation of metalcontaining catalyst would deteriorate the insulating properties of the dielectric polymers, bring in additional insulation defects [78] and increase the probability of electrical tree inception. Various single-component extrinsic self-healing systems without catalysts have been developed utilizing the healing agents that can cure under external stimulations or upon contacting other reactants, [79][80][81] providing opportunities for developing catalystfree self-healing dielectric polymers. But whether or not the healing kinetics can surpass that of the electrical damage process needs to be evaluated.…”

Section: Extrinsic Self-healing Methodsmentioning

confidence: 99%

Self‐Healing of Electrical Damage in Polymers

Yang

Dang

et al. 2020

Advanced Science

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Polymers are widely used as dielectric components and electrical insulations in modern electronic devices and power systems in the industrial sector, transportation, and large appliances, among others, where electrical damage of the materials is one of the major factors threatening the reliability and service lifetime. Self‐healing dielectric polymers, an emerging category of materials capable of recovering dielectric and insulating properties after electrical damage, are of promise to address this issue. This paper aims at summarizing the recent progress in the design and synthesis of self‐healing dielectric polymers. The current understanding to the process of electrical degradation and damage in dielectric polymers is first introduced and the critical requirements in the self‐healing of electrical damage are proposed. Then the feasibility of using self‐healing strategies designed for repairing mechanical damage in the healing of electrical damage is evaluated, based on which the challenges and bottleneck issues are pointed out. The emerging self‐healing methods specifically designed for healing electrical damage are highlighted and some useful mechanisms for developing novel self‐healing dielectric polymers are proposed. It is concluded by providing a brief outlook and some potential directions in the future development toward practical applications in electronics and the electric power industry.

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“…Self‐healing materials based on ethyl phenyl acetate (EPA) microcapsules could fully restore fracture toughness of epoxy resin (with healing efficiencies up to 100%) and heal fiber/matrix interfacial debone strength and thermoplastics . Thus, the mechanical properties of urea–formaldehyde (UF) microcapsules filled with ethyl phenyl acetate were investigated.…”

Section: Introductionmentioning

confidence: 99%

Estimation of the mechanical properties of urea–formaldehyde microcapsules by compression tests and finite element analysis

Ma¹,

Zhang²,

Zhao³

et al. 2016

J of Applied Polymer Sci

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Information on the mechanical properties of microcapsules is essential to understanding their performance during manufacturing, processing, and applications. The mechanical properties of urea-formaldehyde (UF) microcapsules filled with ethyl phenyl acetate (EPA) were determined by applying single-microcapsule compression and a finite element model. Microcapsules were prepared by in situ polymerization, and the average wall thickness of microcapsules was 192 6 12 nm as determined using scanning electron microscopy. The deformation behavior of the microcapsule was measured by a single-microcapsule compression experiment between two parallel plates. The results show that both burst deformation and burst force were linearly related to microcapsule size. A model for an elastic shell filled with incompressible fluid was used to simulate compression of the microcapsule in ABAQUS. Dimensionless parameters were introduced to the model. The relationship between dimensionless force and dimensionless displacement depended on the ratio of wall thickness to diameter (e). However, the relationship remained the same when e was less than 1% and can be fitted well by the mathematical equation. An estimation of Young's modulus can be obtained from the compression data for the dimensionless deformation from 10% to 15%. The average Young's modulus of a UF/EPA microcapsule is estimated to be 2.12 6 0.45 GPa.

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Autonomic healing of PMMA via microencapsulated solvent

Cited by 31 publications

References 46 publications

Stereolithographic 3D printing of extrinsically self-healing composites

Stereolithographic 3D printing of extrinsically self-healing composites

Self‐Healing of Electrical Damage in Polymers

Estimation of the mechanical properties of urea–formaldehyde microcapsules by compression tests and finite element analysis

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