1998
DOI: 10.1109/16.725242
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Avalanche multiplication noise characteristics in thin GaAs p/sup +/-i-n/sup +/ diodes

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Cited by 131 publications
(104 citation statements)
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“…Since this ratio is a material property, for a given electric field, efforts to improve the APD performance have focused on optimizing the electric field profile and characterizing new materials. Recently, lower multiplication noise and higher gainbandwidth products have been achieved by sub micrometer scaling of the thickness of the multiplication region [4][5][6][7][8][9][10][11][12]. This is in direct contrast to what would have been predicted by the local-field model and is due to the nonlocal nature of impact ionization, which can be neglected if the thickness of the multiplication region is much greater than the "dead length", the distance over which carriers gain sufficient energy to impact ionize.…”
Section: Introductioncontrasting
confidence: 43%
“…Since this ratio is a material property, for a given electric field, efforts to improve the APD performance have focused on optimizing the electric field profile and characterizing new materials. Recently, lower multiplication noise and higher gainbandwidth products have been achieved by sub micrometer scaling of the thickness of the multiplication region [4][5][6][7][8][9][10][11][12]. This is in direct contrast to what would have been predicted by the local-field model and is due to the nonlocal nature of impact ionization, which can be neglected if the thickness of the multiplication region is much greater than the "dead length", the distance over which carriers gain sufficient energy to impact ionize.…”
Section: Introductioncontrasting
confidence: 43%
“…Also shown are the wafer positions at which measurements were taken, i.e., center ("c"), edge ("e"), or from center to edge ("c-e") of wafer. All wafers are as-grown, except for wafer E which is annealed at 850 C. thickness (w) measured by Li et al 9,15 It is evident from Fig. 2 that k ¼ b/a of GaInNAs is very similar to that of GaAs for N fractions 2.0%.…”
mentioning
confidence: 92%
“…The w ¼ 0.4 lm p þ -i-n þ devices at the edge of wafer B, which contain 2.0% N, gave a k value (k ¼ 0.4) similar to that of a slightly thinner GaAs p þ -i-n þ diode, 15 as well as that of a slightly thicker GaNAs p þ -i-n þ diode with 0.75% N reported by Kinsey et al 5 Wafer A with w ¼ 1.0 lm and 1.0% N gave k ¼ 0.5, which is close to the k ¼ 0.6 of a GaAs diode with w ¼ 1.13 lm. 9 In contrast, for N content !3.0% the excess noise increases for both thin and thick GaInNAs structures as shown in Fig. 2, with an approximately two-fold increase in k compared with GaAs.…”
mentioning
confidence: 99%
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“…If the primary photocarrier is a hole then k = α/β and if it is an electron then k = β/α. However, recent experimental measurements on GaAs APD's [3,4,5,6] have shown a significant reduction in excess noise factor as iregion thickness decreases below one micron. A carrier starting with near zero energy, relative to the band edge, will have an almost zero chance of having an ionizing collision until it has gained sufficient energy from the electric field to attain the necessary energy to permit impact ionization [7,8].…”
Section: Introductionmentioning
confidence: 99%