B1.3 - Printed Piezoresistive Strain Sensors for Monitoring of Light-Weight Structures

Rausch, Jacqueline; Salun, Larisa; Grieheimer, St.; Ibis, Mesut; Werthschützky, Roland

doi:10.5162/sensor11/b1.3

Cited by 6 publications

References 9 publications

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Hybrid Systems-in-Foil

Elsobky

Burghartz

2021

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Hybrid Systems-in-Foil (HySiF) is a concept that extends the potential of conventional More-than-More Systems-in/on-Package (SiPs and SoPs) to the flexible electronics world. In HySiF, an economical implementation of flexible electronic systems is possible by integrating a minimum number of embedded silicon chips and a maximum number of on-foil components. Here, the complementary characteristics of CMOS SoCs and larger area organic and printed electronics are combined in a HySiF-compatible polymeric substrate. Within the HySiF scope, the fabrication process steps and the integration design rules with all the accompanying boundary conditions concerning material compatibility, surface properties, and thermal budget, are defined. This Element serves as an introduction to the HySiF concept. A summary of recent ultra-thin chip fabrication and flexible packaging techniques is provided. Several bendable electronic components are presented demonstrating the benefits of HySiF. Finally, prototypes of flexible wireless sensor systems that adopt the HySiF concept are demonstrated.

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Hybrid Systems-in-Foil

Elsobky

Burghartz

2021

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Biocompatible inkjet resistive sensors for biomedical applications

Dionisi

Borghetti

Sardini

et al. 2014

2014 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) Proceedings

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A resistive sensor for strain measurements that uses inkjet technology for biomedical applications has been studied, designed, manufactured and tested. Preliminary experimental results of a single sensor are shown and commented. The inkjet printing process is based on the emission through a nozzle of a material in liquid phase in fixed quantity, usually called ink, in the form of microscopic droplets contained in a cartridge. The emitted drop falls on a substrate, forming a pattern. The liquid solidification can occur through the solvent evaporation, chemical modifications or crystallization. Often a post-processing is required, such as thermal annealing or sintering. For the realization of the resistive sensor, a nanocrystalline silver ink was chosen. The substrate is Kapton and several studies demonstrate its biocompatibility as well. In this paper, a preliminary analysis of the material, its compatibility with the desired printer, the design considerations and finally the experimental results with the calculation of the Gauge Factor are shown. The research purpose is to study sensors, thin, flexible, inexpensive, and biocompatible for applications within the human body. © 2014 IEEE

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ObjectSkin

Groeger

Steimle

2018

Proc. ACM Interact. Mob. Wearable Ubiquitous Technol.

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Augmenting everyday objects with interactive input and output surfaces is a long-standing topic in ubiquitous computing and HCI research. Existing approaches, however, fail to leverage the objects' full potential, particularly in highly curved organic geometries and in diverse visuo-haptic surface properties. We contribute ObjectSkin, a fabrication technique for adding conformal interactive surfaces to rigid and flexible everyday objects. It enables multi-touch sensing and display output that seamlessly integrates with highly curved and irregular geometries. The approach is based on a novel water-transfer process for interactive surfaces. It leverages off-the-shelf hobbyist equipment to fabricate thin, conformal, and translucent electronic circuits that preserve the surface characteristics of everyday objects. It offers two methods, for rapid low-fidelity and versatile high-fidelity prototyping, and is applicable to a wide variety of materials. Results from a series of technical experiments provide insights into the supported object geometries, compatible object materials, and robustness. Seven example cases demonstrate how ObjectSkin makes it possible to leverage geometries, surface properties, and unconventional objects for prototyping novel interactions for ubiquitous computing.

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B1.3 - Printed Piezoresistive Strain Sensors for Monitoring of Light-Weight Structures

Cited by 6 publications

References 9 publications

Hybrid Systems-in-Foil

Hybrid Systems-in-Foil

Biocompatible inkjet resistive sensors for biomedical applications

ObjectSkin

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