B4.1 - Trends in Assembly and Packaging of Sensors

Wilde, Juergen

doi:10.5162/sensor09/v1/b4.1

Cited by 6 publications

(4 citation statements)

References 3 publications

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“…The production of packages at different levels plays a major role in the microassembly technology [1]. The wide range of different requirements related to packaging solutions in the fields of automotive, medical, and automation industries is also increasing by the day [2]. The requirement of integrating more and more functions in an electronic assembly stimulates more challenges regarding miniaturization, robustness, reliability, and cost reduction in manufacturing [3].…”

Section: Introductionmentioning

confidence: 99%

An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages

Kulkarni

Wappler

Soltani

et al. 2019

JMMP

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An ever-growing market demand for board (second) level packages (e.g., embedded systems, system-on-a-chip, etc.) poses newer challenges for its manufacturing industry in terms of competitive pricing, higher reliability, and overall dimensions. Such packages are encapsulated for various reasons including thermal management, protection from environmental conditions and dust particles, and enhancing the mechanical stability. In the due course of reducing overall sizes and material saving, an encapsulation as thin as possible imposes its own significance. Such a thin-walled conformal encapsulation serves as an added advantage by reducing the thermo-mechanical stresses occurring due to thermal-cyclic loading, compared to block-sized or thicker encapsulations. This paper assesses the encapsulation process of a board-level package by means of thermoset injection molding. Various aspects reviewed in this paper include the conception of a demonstrator, investigation of the flow simulation of the injection molding process, execution of molding trials with different encapsulation thicknesses, and characterization of the packages. The process shows a high dependence on the substrate properties, injection molding process parameters, device mounting tolerances, and device geometry tolerances. Nevertheless, the thermoset injection molding process is suitable for the encapsulation of board-level packages limiting itself only with respect to the thickness of the encapsulation material, which depends on other external aforementioned factors.

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Section: Introductionmentioning

confidence: 99%

An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages

Kulkarni

Wappler

Soltani

et al. 2019

JMMP

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“…Furthermore, the integration of Hall sensors in electronics typically requires the semiconductor chips to be embedded in packaging. Industrially produced graphene Hall sensors could adopt hermetic packaging 45 in a vacuum or an inert atmosphere to mitigate the aging issues.…”

Section: ■ Results and Discussionmentioning

confidence: 99%

Highly Sensitive Hall Sensors Based on Chemical Vapor Deposition Graphene

Tyagi,

Martini,

Gebeyehu

et al. 2023

ACS Appl. Nano Mater.

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In this work, we demonstrate highly sensitive and scalable Hall sensors fabricated by adopting arrays of monolayer single-crystal chemical vapor deposition (CVD) graphene. The devices are based on graphene Hall bars with a carrier mobility of >12000 cm 2 V −1 s −1 and a low residual carrier density of ∼1 × 10 11 cm −2 , showing Hall sensitivity higher than 5000 V A −1 T −1 , which is a value previously only achieved when using exfoliated graphene encapsulated with flakes of hexagonal boron nitride. We also implement a facile and scalable polymeric encapsulation, allowing the performance of graphene Hall bars to be stabilized when measured in an ambient environment. We demonstrate that this capping method can reduce the degradation of electrical transport properties when the graphene devices are kept in air over 10 weeks. State-of-the-art performance of the realized devices, based on scalable synthesis and encapsulation, contributes to the proliferation of graphene-based Hall sensors.

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“…LTCC provides special 3D-structuring abilities, which enables liquid cooling system integration [1], special biomedical sensors [2][3][4] and fluidic structures [2,5]. Such LTCC architectures are sensitive to thermo-mechanical stresses.…”

Section: Introductionmentioning

confidence: 99%

“…Alternate methods for initiating the reaction include the means of using an electric spark or laser pulse [22], whereafter the reaction can also continue to self-propagate. LTCC provides special 3D-structuring abilities, which enables liquid cooling system integration [1], special biomedical sensors [2][3][4] and fluidic structures [2,5]. Such LTCC architectures are sensitive to thermo-mechanical stresses.…”

Section: Introductionmentioning

confidence: 99%

The Simulated Effect of Adding Solder Layers on Reactive Multilayer Films Used for Joining Processes

et al. 2022

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In order to introduce new bonding methods in the area of electronic packaging a theoretical analysis was conducted, which should give substantial information about the potential of reactive multilayer systems (rms) to create sufficient local heat for joining processes between silicon chips and ceramic substrates. For this purpose, thermal CFD (computational fluid dynamics) simulations have been carried out to simulate the temperature profile of the bonding zone during and after the reaction of the rms. This thermal analysis considers two different configurations. The first configuration consists of a silicon chip that is bonded to an LTCC-substrate (Low Temperature Co-fired Ceramics) using a bonding layer that contains an rms and a solder preform. The reaction propagation speed of the reactive multilayer was set to a value of 1 m/s, in order to partially melt a solder preform underneath a silicon chip. The second configuration, which consists only of the LTCC-substrate and the rms, was chosen to study the differences between the thermal outputs of the two arrangements. The analysis of the CFD simulations was particularly focused on interpretations of the temperature and liquid fraction contours. The CFD thermal simulation analysis conducted contains a melting/solidification model which can track the molten/solid state of the solder in addition to modelling the influence of latent heat. To provide information for the design of a test-substrate for experimental investigations, the real behaviour of Pt-100 temperature probes on the LTCC-substrate was simulated, in order to monitor an actual bonding in the experiment. All simulations were carried out using the ANSYS Fluent software.

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B4.1 - Trends in Assembly and Packaging of Sensors

Cited by 6 publications

References 3 publications

An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages

An Assessment of Thermoset Injection Molding for Thin-Walled Conformal Encapsulation of Board-Level Electronic Packages

Highly Sensitive Hall Sensors Based on Chemical Vapor Deposition Graphene

The Simulated Effect of Adding Solder Layers on Reactive Multilayer Films Used for Joining Processes

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