Batch-processed vacuum-sealed capacitive pressure sensors

Chavan, A.V.; Wise, K.D.

doi:10.1109/84.967381

Cited by 116 publications

(39 citation statements)

References 13 publications

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“…However, to fabricate capacitive absolute pressure sensors with sealed vacuum cavities, with leads carrying current from inside the upper electrode diaphragm, requires relatively complex fabrication technology [3]. This is because the process requires heat treatment at more than 1000 using a vacuum furnace, after initial bonding at a temperature of 500 to bond the two Si wafers [4].…”

Section: Introductionmentioning

confidence: 99%

Fabrication of capacitive absolute pressure sensor using Si-Au eutectic bonding in SOI wafer

Lee¹,

Kim²,

Park³

et al. 2006

J. Phys.: Conf. Ser.

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Abstract.A capacitive absolute pressure sensor was fabricated using a large deflected diaphragm with a sealed vacuum cavity formed by removing handling silicon wafer and oxide layers from a SOI wafer after eutectic bonding of a silicon wafer to the SOI wafer. The deflected displacements of the diaphragm formed by the vacuum cavity in the fabricated sensor were similar to simulation results. Initial capacitance values were about 2.18pF and 3.65pF under normal atmosphere, where the thicknesses of the diaphragm used to fabricate the vacuum cavity were 20 and 30 , respectively. Also, it was confirmed that the differences of capacitance value from 1000hPa to 5hPa were about 2.57pF and 5.35pF, respectively.

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Section: Introductionmentioning

confidence: 99%

Fabrication of capacitive absolute pressure sensor using Si-Au eutectic bonding in SOI wafer

Lee¹,

Kim²,

Park³

et al. 2006

J. Phys.: Conf. Ser.

View full text Add to dashboard Cite

show abstract

“…Furthermore, the advance of micro-and nanolithography technology makes the manufacturing of MEMS devices more reproducible and inexpensive. There are numerous MEMS devices around us such as micro accelerometers [45,46], DMD [45,47,48], MEMS pressure sensors [49,50], micropumps [58][59][60], microvalves [61], optical switches [62,63], inkjet heads, microgrippers [64,65], and microactuators [66][67][68][69][70]. For examples, MEMS accelerometers are employed for crashairbag deployment in automobiles and for motion detection in consumer electronic devices such as game controllers (e.g., Nintendo Wii), iPhone and other smartphones.…”

Section: Electronics and Microsystemsmentioning

confidence: 99%

“…Not only micro-and nanolithography has been the main driving technology in the semiconductor and IC industry, it also plays an increasingly important role in manufacturing of commercial microelectromechanical system (MEMS) devices [45][46][47][48][49][50] as well as prototype fabrication in emerging nanoscale science and engineering [51][52][53][54][55][56]. These applications are expected to significantly improve our quality of lives in many ways from electronic gadgets to healthcare and medical devices.…”

Section: Introductionmentioning

confidence: 99%

“…These applications are expected to significantly improve our quality of lives in many ways from electronic gadgets to healthcare and medical devices. Some examples of commercial MEMS products include MEMS accelerometers employed in automobiles and consumer electronic devices [45,46], digital micromirror devices (DMD) for display applications in projectors and televisions [45,47,48], and MEMS pressure sensors for detecting pressures in car tires and blood vessels [49,50]. Furthermore, nanoscience and engineering has increasingly contributed to conventional technologies by opening up alternative routes to overcome current technical barriers, to name a few of them, nanoelectronics for denser and faster computing, nanomedicine for diagnosis and treatment of many diseases including cancers [51][52][53][54], heart disease and Alzheimer's disease [55,56], nanoelectromechanical systems for high-sensitivity and high-resolution sensing and manipulating, and nanobiosensors for ultra-low concentration and single molecular detection.…”

Section: Introductionmentioning

confidence: 99%

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Review on Micro- and Nanolithography Techniques and their Applications

2012

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Abstract. This article reviews major micro-and nanolithography techniques and their applications from commercial micro devices to emerging applications in nanoscale science and engineering. Micro-and nanolithography has been the key technology in manufacturing of integrated circuits and microchips in the semiconductor industry. Such a technology is also sparking revolutionizing advancements in nanotechnology. The lithography techniques including photolithography, electron beam lithography, focused ion beam lithography, soft lithography, nanoimprint lithography and scanning probe lithography are discussed. Furthermore, their applications are summarized into four major areas: electronics and microsystems, medical and biotech, optics and photonics, and environment and energy harvesting.

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“…These applications are expected to significantly improve a quality of human life in many ways from electronic gadgets, healthcare and medical devices to future energy sources. Some examples of commercial MEMS products include MEMS accelerometers employed in automobiles and consumer electronic devices [2][3], digital micro-mirror devices for display applications in projectors and televisions [4][5], and MEMS pressure sensors for detecting pressures in car tires and blood vessels [6][7]. Functional elements of these devices often require thick metallic microstructures such as actuating and sensing units driven by electrostatic and electromagnetic principles.…”

Section: Introductionmentioning

confidence: 99%

Modification of a Substrate Roughness for a Fabrication of Freestanding Electroplated Metallic Microstructures

Pimpin

Srituravanich

2017

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Abstract.This study aims to demonstrate a simple fabrication technique of freestanding electroplated metallic microstructures by modifying a substrate roughness. The proposed technique utilizes counter effects between two forces, i.e. an intrinsic force causing shrinkage in an electroplated metallic microstructure, and an adhesive force adhering a metallic microstructure to a substrate. With the modification of substrate roughness until the adhesive force becomes weaker than the induced intrinsic force, electroplated metallic microstructures would spontaneously release from the substrate after the electroplating process. Three parameters, i.e. substrate roughness, electroplated square structure's area and electroplated rectangular structure's width-to-length ratio, were experimentally studied. The results showed that the electroplated structure with a smaller size and smaller width-to-length ratio was more easily detached from the substrate for a given substrate roughness. In addition, for the same electroplated structure, a substrate with less roughness allowed a detachment of electroplated microstructure more easily.

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Batch-processed vacuum-sealed capacitive pressure sensors

Cited by 116 publications

References 13 publications

Fabrication of capacitive absolute pressure sensor using Si-Au eutectic bonding in SOI wafer

Fabrication of capacitive absolute pressure sensor using Si-Au eutectic bonding in SOI wafer

Review on Micro- and Nanolithography Techniques and their Applications

Modification of a Substrate Roughness for a Fabrication of Freestanding Electroplated Metallic Microstructures

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