2004
DOI: 10.1007/s10832-004-5082-2
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BaTiO3 Films by Low-Temperature Hydrothermal Techniques for Next Generation Packaging Applications

Abstract: This work reports synthesis, characterization and integration of sub-micron thick nano-grained barium titanate films on organic Printed Wiring Boards (PWB). Barium titanate films were synthesized on titanium foils at 95 • C. SEM of films revealed 80 nm grains. The films were characterized using XRD, FTIR and Raman spectroscopy. As-synthesized films exhibited high capacitance densities and dielectric loss. The films were treated with oxygen plasma to reduce entrapped hydroxyl groups and this resulted in improve… Show more

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Cited by 17 publications
(11 citation statements)
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“…The pH of the solution was measured to be 13.5 at 95°C. The optimum Ba(OH) 2 concentration for hydrothermal BaTiO 3 synthesis was found to be 2 M from the authors' earlier studies [13]. The Ti-film on Si-wafer was placed facing down on Teflon frames in the solution in order to avoid precipitates from settling onto the surface and locally inhibiting formation of BaTiO 3 .…”
Section: Experimental Methodsmentioning
confidence: 99%
“…The pH of the solution was measured to be 13.5 at 95°C. The optimum Ba(OH) 2 concentration for hydrothermal BaTiO 3 synthesis was found to be 2 M from the authors' earlier studies [13]. The Ti-film on Si-wafer was placed facing down on Teflon frames in the solution in order to avoid precipitates from settling onto the surface and locally inhibiting formation of BaTiO 3 .…”
Section: Experimental Methodsmentioning
confidence: 99%
“…2M Ba(OH) 2 was found to be the optimum concentration for hydrothermal BaTiO 3 synthesis from the authors' earlier studies. 20 The Ti film on Si wafer was placed on Teflon rings in the solution, facing down in order to avoid the precipitates from settling onto the surface, which may locally inhibit the formation of BaTiO 3 . The reaction was allowed to proceed for 24 h in an oven at 951C.…”
Section: Experimental Methodsmentioning
confidence: 99%
“…Numerous passive integration platforms are investigated world wide, where passive functions such as capacitors, resistors or inductors are integrated using either laminate technologies or LTCC (low temperature cofired ceramic) technologies or thin film technologies on insulating substrates such as glass or ceramic [1,2,3,4,5]. Integration of passive functions with active functions into System in Package devices reduces component count and frees up board space for additional functionality in e.g.…”
Section: Integration Of Ferroelectric Mim Capacitors With Resistors Amentioning
confidence: 99%