Bauschinger Effect Analysis in Polycrystalline Copper: an Atomistic Simulation

Rajput, Ashutosh; Paul, Surajit Kumar

doi:10.1007/s41403-021-00266-3

Trans Indian Natl. Acad. Eng.

2021

DOI: 10.1007/s41403-021-00266-3

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Bauschinger Effect Analysis in Polycrystalline Copper: an Atomistic Simulation

Ashutosh Rajput

Surajit Kumar Paul

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2024

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Cyclic Failure of a Cr–Au Bilayer on Polyimide: In Situ Transmission Electron Microscopy Observations of Interfacial Dislocation Mechanisms

Gebhart,

Krapf,

Schretter

et al. 2024

Adv Eng Mater

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This work presents in situ transmission electron microscopy observations of dislocation activities and associated fatigue properties in a cross‐sectional sample of a Cr–Au bilayer on a polyimide substrate under cyclic loading. Dislocation structures in the Au layer are observed to evolve into a geometrically necessary boundary parallel to the Cr–Au interface, which significantly impedes dislocation motion and plays a crucial role in enhancing the fatigue resistance of the studied sample. While a comparison to the damage in a conventional blanket film testing geometry reveals some differences in the accumulation of plastic flow, the findings can provide insights into the underlying mechanisms governing fatigue in nanostructured multilayer materials on polymer substrates.

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Cyclic Failure of a Cr–Au Bilayer on Polyimide: In Situ Transmission Electron Microscopy Observations of Interfacial Dislocation Mechanisms

Gebhart,

Krapf,

Schretter

et al. 2024

Adv Eng Mater

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show abstract

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Bauschinger Effect Analysis in Polycrystalline Copper: an Atomistic Simulation

Cited by 1 publication

References 22 publications

Cyclic Failure of a Cr–Au Bilayer on Polyimide: In Situ Transmission Electron Microscopy Observations of Interfacial Dislocation Mechanisms

Cyclic Failure of a Cr–Au Bilayer on Polyimide: In Situ Transmission Electron Microscopy Observations of Interfacial Dislocation Mechanisms

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