2019
DOI: 10.7567/1347-4065/ab1fd6
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Bayesian inference of a lifetime distribution parameter on the time-dependent dielectric breakdown with clustering defects

Abstract: In this study, we compared three statistical methods including the Bayesian inference to evaluate the lifetime distribution of time-dependent dielectric breakdown with clustered defects. Especially, we focused on the effect of the prior information of the Bayesian inference to obtain an accurate low cumulative failure probability of lifetime distribution. The prior information about the breakdown physics can give an appropriate range of shape parameter of the distribution function. In comparison with the conve… Show more

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Cited by 2 publications
(5 citation statements)
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“…In this case, the probability plot shows a convex upward shape. [9][10][11][12][13][14][15][16][17][18] In the semiconductor reliability domain, as mentioned above, the Weibull distribution is assumed for dielectric breakdown with a temporospatial homogeneousness. Particularly, the weakest link concept will correspond to the TDDB lifetime.…”
Section: Break Of the Uniformity Assumptionmentioning
confidence: 99%
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“…In this case, the probability plot shows a convex upward shape. [9][10][11][12][13][14][15][16][17][18] In the semiconductor reliability domain, as mentioned above, the Weibull distribution is assumed for dielectric breakdown with a temporospatial homogeneousness. Particularly, the weakest link concept will correspond to the TDDB lifetime.…”
Section: Break Of the Uniformity Assumptionmentioning
confidence: 99%
“…The applications of a TDC model that describes the non-Poisson characteristics of a lifetime applied to TDDB are introduced. The physical and statistical background of the modeling and the mathematical methods for the accurate parameter extraction [14][15][16][17][18] are introduced. These elements provide methods to analyze and evaluate the TDDB characteristics affected by complicated defect densities.…”
Section: Introductionmentioning
confidence: 99%
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