Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere

He, Shuo; Shen, Yu-An; Xiong, Bifu; Huo, Fupeng; Li, Jiahui; Ge, Jijiang; Pan, Zhiliang; Li, Wangyun; Hu, Chuan; Nishikawa, Hiroshi

doi:10.1016/j.jmrt.2022.10.056

Cited by 19 publications

(7 citation statements)

References 51 publications

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“…In most power-device manufacturing processes, dies are attached to substrates using Sn-based solders . However, because the melting point of Sn-based solders is low, such as the melting point of 217–219 °C of Sn-3.0Ag-0.5Cu solder, these solders tend to experience remelting and serious stability issues at high operating temperatures exceeding 250 °C. , Therefore, the development of die attachment materials that can endure high operating temperatures is in great demand.…”

Section: Introductionmentioning

confidence: 99%

Transparent Liquid Ag-Based Complex for the Facile Preparation of Robust Sintered Ag Joints in Power Devices

Wang,

Tatsumi,

et al. 2024

ACS Appl. Electron. Mater.

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Simplifying the bonding technique used to package power devices is crucial for electric vehicles and 5G communication. Herein, a transparent liquid Ag-based complex was employed to simplify the Ag sintering process. The complex can directly fabricate Ag nanostructures on substrates and dies by thermal decomposition at 180 °C for 30 min. These nanostructures consisted of linked nanoparticles with a wide size distribution and exhibited remarkable compressibility, indicating an excellent potential for sintering. Unlike traditional Ag paste, the Ag-based complex presented a single phase, and the obtained Ag nanostructures could be directly sintered at a low temperature. Robust sintered Ag joints with a high average shear strength of 45.4 MPa and a low porosity of 9.3% were successfully achieved by sintering at 300 °C and 5 MPa for 40 min. Such joint properties can be attributed to the frame−filler structure generated during sintering. This structure, which featured large Ag particles acting as frames and small Ag particles acting as bridges linking the frames, was beneficial for improving the sintering performance of the Ag nanostructures. The Ag-based complex could be used for the facile preparation of robust sintered Ag joints, creating possibilities for die attachment while reducing manufacturing costs.

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Section: Introductionmentioning

confidence: 99%

Transparent Liquid Ag-Based Complex for the Facile Preparation of Robust Sintered Ag Joints in Power Devices

Wang,

Tatsumi,

et al. 2024

ACS Appl. Electron. Mater.

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“…The peculiar mesh-like structure of Cu porous can improve the contact area between Cu and Sn, enhancing the performance of the solder joint [5] . Despite previous studies on Cu porous as a sandwich structure intermediate layer, there has been no direct comparison of intermetallic compound (IMC) shear strength between SAC and Sn58Bi [6,7] . The study aimed to examine the impact of two solder types on the bonding strength of TLP joints by applying Sn58Bi and SAC to the top and lower surfaces of the Cu porous layer in a sequential manner.…”

Section: Introductionmentioning

confidence: 99%

Effect of liquid solder on shear strength of solder/Cu porous joint

Jiang,

He,

Xiong

et al. 2024

Fourth International Conference on Mechanical Engineering, Intelligent Manufacturing, and Automation Technology (MEMAT 2023)

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Power semiconductor devices have seen a rise in the development of wide bandgap (WBG) semiconductors. WBG devices can be bonded at low temperatures due to the transient liquid phase (TLP) bonding process. Applying Cu porous in TLP has been the subject of relevant studies. The strength of metallic joints created by various solders with Cu porous, however, has received less attention in earlier investigations. In this study, the shear strength of metallic joints made of SAC and Sn58Bi is examined. Cu porous was used as an intermediate metal layer, and a 0.2 mm layer of Sn58Bi / SAC solder paste was applied to its top and bottom surfaces. Research has also looked into the impact of bonding time. It can be inferred that the metal junctions formed with SAC solder are stronger and better suited for transient liquid bonding.

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“…The eutectic Sn-58Bi alloy performs good wettability with bonding metallic substrates [ 23 , 24 , 25 , 26 ]. The eutectic Sn-58Bi alloy contains precipitated Bi that creates numerous phase boundaries and serves as a secondary phase within the Sn matrix [ 27 , 28 , 29 ].…”

Section: Introductionmentioning

confidence: 99%

Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere

Xiong

et al. 2023

Materials

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This study proposes a low-temperature transient liquid phase bonding (TLPB) method using Sn58Bi/porous Cu/Sn58Bi to enable efficient power-device packaging at high temperatures. The bonding mechanism is attributed to the rapid reaction between porous Cu and Sn58Bi solder, leading to the formation of intermetallic compounds with high melting point at low temperatures. The present paper investigates the effects of bonding atmosphere, bonding time, and external pressure on the shear strength of metal joints. Under formic acid (FA) atmosphere, Cu6Sn5 forms at the porous Cu foil/Sn58Bi interface, and some of it transforms into Cu3Sn. External pressure significantly reduces the micropores and thickness of the joint interconnection layer, resulting in a ductile fracture failure mode. The metal joint obtained under a pressure of 10 MPa at 250 °C for 5 min exhibits outstanding bonding mechanical performance with a shear strength of 62.2 MPa.

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Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere

Cited by 19 publications

References 51 publications

Transparent Liquid Ag-Based Complex for the Facile Preparation of Robust Sintered Ag Joints in Power Devices

Transparent Liquid Ag-Based Complex for the Facile Preparation of Robust Sintered Ag Joints in Power Devices

Effect of liquid solder on shear strength of solder/Cu porous joint

Low-Temperature Transient Liquid Phase Bonding Technology via Cu Porous-Sn58Bi Solid–Liquid System under Formic Acid Atmosphere

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