Behaviour of anisotropic conductive joints under mechanical loading

Tan, C.W.; Chan, Y.C.; Yeung, N.H.

doi:10.1016/s0026-2714(02)00318-9

Cited by 34 publications

(10 citation statements)

References 8 publications

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“…Many materials have an endurance limit below which it is not subjected to fatigue failure. Lower stress fatigue failure commonly starts as surface cracks at 10%-20% of the fatigue life [14]. Fig.…”

Section: Shear Fatigue Testmentioning

confidence: 99%

Mechanical Behavior and Low-Cycle Shear Fatigue Life of the Pure Ni Laser-Welded Joints in Optoelectronics Packaging

Tan

Chan

Leung

et al. 2008

IEEE Trans. Adv. Packag.

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The aim of this study is to characterize the behaviors of laser-welded joint between pure nickel (Ni200) weld clip and Kovar base metal under various mechanical loadings, i.e. shear and fatigue in shear. A Nd:YAG laser source with 1064 nm was used to weld a 1 0 1 0 0 2 mm Ni200 piece onto a Kovar substrate by single weld spot. These samples were then subjected to shear test. While the shear fatigue cyclic tests on the four welding spots that joined Ni200 saddle shape weld clip onto the Kovar base metal. Results show that power density is the key parameter that determines the beam penetration depth and overlapping area. The pulse width has dominant effects on the weld width while the charge voltage dominant the depth of penetration and thus increases the absorbed power density. The maximum shear force requires to break a joint is ranged between 90-95, 70-75, and less than 45 N when welded by 380, 360, and 340 V, respectively. The shear strength is very much depends on the spot welding diameter and beam penetration depth. In general, higher pulse width increases the joint diameter and thus reduces the shear strength. The condition of dimples observed in the fracture surface after shear test provides important indication on the properties of the weld joints. The fatigue life for the weld formed by using the selected welding condition ranges from 1178 to 1813 cycles. The fatigue ratios obtained show that the stress below endurance limit has about 17%-23% possibility that fatigue failure will never occur for joints formed by using this range of welding conditions. The surface condition of the fracture surface after shear fatigue test provide direct indication on the crack propagation rate. Observations of all fracture surfaces by scanning electron microscope (SEM) help in understanding the deformation and damage mechanisms of Ni200 laser-welded joint at room temperature.

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Section: Shear Fatigue Testmentioning

confidence: 99%

Mechanical Behavior and Low-Cycle Shear Fatigue Life of the Pure Ni Laser-Welded Joints in Optoelectronics Packaging

Tan

Chan

Leung

et al. 2008

IEEE Trans. Adv. Packag.

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“…The lid shear test was carried out by using an IN-STRON Mini 44 Tester with a cross-head speed of 5 mm/min on 20 samples [6]. The shear blade was placed approximately 0.5 mm from the top surface of fiber block.…”

Section: Shear Testmentioning

confidence: 99%

Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging

Tan

Chan

et al. 2004

Microelectronics Reliability

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“…9,10) When the COG bonding technology using ACF is applied to mount a fine pitch (< 50 mm) LCD driver IC, an electrical short is sometimes generated between the adjacent bumps due to the electrical bridging by conductive particle agglomeration between the bumps. 7) Because of this, contact resistances either increase or the interconnect will be prone to opening due to the reduction in pitch and contact size.…”

Section: Introductionmentioning

confidence: 99%

Non-Conductive Adhesive (NCA) Trapping Study in Chip on Glass Joints Fabricated Using Sn Bumps and NCA

Lee

Kim

2008

Mater. Trans.

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Chip-on-glass (COG) bonding using a nonconductive adhesive (NCA) and the entrapment of NCA and fillers in the COG joints were studied. Sn was used as a bump material because it has a higher propensity of plastic deformation than an Au bump. Three types of Sn bumps were fabricated, electroplated Sn bumps, reflowed Sn bumps, and coined Sn bumps. Three types of NCAs were applied during COG bonding. The reflowed bump had the least amount of trapped NCA with fillers among the bumps studied. The NCA with the lowest viscosity was trapped the least compared to the other NCAs. The electrical test results showed that contact resistance increased with increasing amounts of trapped NCA with fillers in the COG joint.

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Behaviour of anisotropic conductive joints under mechanical loading

Cited by 34 publications

References 8 publications

Mechanical Behavior and Low-Cycle Shear Fatigue Life of the Pure Ni Laser-Welded Joints in Optoelectronics Packaging

Mechanical Behavior and Low-Cycle Shear Fatigue Life of the Pure Ni Laser-Welded Joints in Optoelectronics Packaging

Investigation on bondability and reliability of UV-curable adhesive joints for stable mechanical properties in photonic device packaging

Non-Conductive Adhesive (NCA) Trapping Study in Chip on Glass Joints Fabricated Using Sn Bumps and NCA

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