Bendable 190-GHz Transmitter on 20-μm Ultra-Thin SiGe BiCMOS

Hoyer, Christian; Steinweg, Luca; Cao, Zhibo; Riess, Vincent; Li, Lei; Protze, Florian; Carta, Corrado; Wagner, Jens; Kaynak, Mehmet; Tillack, Bernd; Ellinger, Frank

doi:10.1109/jflex.2022.3167372

Cited by 7 publications

(3 citation statements)

References 70 publications

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“…The AC resistance was obtained using the fitted frequency-192 While the diode used is not flexible or printable, existing solution-processed Schottky diodes cannot support the required power levels beyond 1 W [32]. The flexibility of the circuit can be improved by using a bare-die component on a thinned chip, making it more bendable [33], where the reliable integration of bare-dies within e-textiles has previously been demonstrated [34]. The rectifier was encapsulated using a conformable pressed PU film, improving the mechanical reliability and isolating the conductive traces from the user.…”

Section: B Coil Capacitor and Rectifier Designmentioning

confidence: 99%

A Wearable All-Printed Textile-Based 6.78 MHz 15 W-Output Wireless Power Transfer System and Its Screen-Printed Joule Heater Application

Wagih

Komolafe

Ullah

et al. 2024

IEEE Trans. Ind. Electron.

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While research in passive flexible circuits for 1 Wireless Power Transfer (WPT) such as coils and res-2 onators continues to advance, limitations in their power 3 handling and low efficiency have hindered the realization 4 of efficient all-printed high-power wearable WPT receivers. 5 Here, we propose a screen-printed textile-based 6.78 MHz 6 resonant inductive WPT system using planar inductors with 7 concealed metal-insulator-metal (MIM) tuning capacitors. A 8 printed voltage doubler rectifier based on Silicon Carbide 9 (SiC) diodes is designed and integrated with the coils, 10 showing a power conversion efficiency of 80-90% for 2-11 40 W inputs over a wide load range. Compared to prior 12 wearable WPT receivers, it offers an order of magnitude im-13 provement in power handling along with higher efficiency 14 (approaching 60%), while using all-printed passives and 15 a compact rectifier. The coils exhibit a simulated Specific 16 Absorption Rate (SAR) under 0.4 W/kg for 25 W received 17 power, and under 21 • C increase in the coils' temperature 18 for a 15 W DC output. Additional fabric shielding is in-19 vestigated, reducing harmonics emissions by up to 17 dB. 20 We finally demonstrate a wirelessly-powered textile-based 21 carbon-silver Joule heater, capable of reaching up to 60 • C 22 at 2 cm separation from the transmitter, as a wearable 23 application which can only be wireless-powered using the 24 proposed system.25

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Section: B Coil Capacitor and Rectifier Designmentioning

confidence: 99%

A Wearable All-Printed Textile-Based 6.78 MHz 15 W-Output Wireless Power Transfer System and Its Screen-Printed Joule Heater Application

Wagih

Komolafe

Ullah

et al. 2024

IEEE Trans. Ind. Electron.

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“…The latter approach has the advantage of high carrier mobilities in established highspeed silicon technologies needed for operation at mmWave frequencies [16]. Thinned down to 20 µm, silicon chips get flexible and even more stable during bending compared to larger thicknesses between 50 µm to 100 µm [17]- [19]. At mmWave frequencies, thinning down these structures impacts not only the characteristics of active devices such as transistors but also passives such as transmission lines [20], [21].…”

Section: (B)mentioning

confidence: 99%

Characterization of Embedded and Thinned RF Chips

Yin,

Morath,

Hoyer

et al. 2024

IMAPSource Proceedings

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This work studies the effect of thinning down chips with transmission line structures for flexible embedding technology. Test chips with 90 Ω grounded coplanar waveguide (GCPW) transmission lines have been designed and manufactured to characterize the high-frequency performance before and after embedding in sheet molding compound (SMC), and thinning down from 300 μm to 20 μm. Molding first technology enables single-die or multiple-die thinning with the embedding material while being held in the exact position, where the subsequent fanout copper (Cu) redistribution layer (RDL) structuring realizes the direct contacts to the embedded chip, followed by semiadditive manufacturing of traces. The embedded and thinned chips are characterized by S-parameter measurements in the frequency range from 20 MHz to 65 GHz using a vector network analyzer (VNA). The results show the feasibility of the examined embedding and thinning processes which are suitable for millimeter wave (mmWave) components as shown by the example of a G-CPW transmission line without degrading its RF performance in terms of characteristic impedance and attenuation.

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“…Therefore, rigid semiconductor die thinning is a common approach for realizing bendable and potentially biodegradable ICs, while retaining most of the performance of conventional ICs. Recently, a 120 GHz transmitter with an on-chip antenna was fabricated in a standard SiGe BiCMOS process and demonstrated high mechanical flexibility after being thinned to 20 μm [18]. The reduction in the die's thickness resulted in around 4 dB loss in the radiated power output but had a minimal influence on the frequency stability.…”

Section: A Sustainable Manufacturing and Recyclingmentioning

confidence: 99%

Next-Generation IoT Devices: Sustainable Eco-Friendly Manufacturing, Energy Harvesting, and Wireless Connectivity

et al. 2023

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The work of Valentina Palazzi, Paolo Mezzanotte, and Luca Roselli was supported by the Italian Ministry of University and Research (MUR) through the PRIN Project "Development and promotion of the Levulinic acid and Carboxylate platforms by the formulation of novel and advanced PHA-based biomaterials and their exploitation for 3D printed green-electronics applications" under Grant 2017FWC3WC 003. This work did not involve human subjects or animals in its research.

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Bendable 190-GHz Transmitter on 20-μm Ultra-Thin SiGe BiCMOS

Cited by 7 publications

References 70 publications

A Wearable All-Printed Textile-Based 6.78 MHz 15 W-Output Wireless Power Transfer System and Its Screen-Printed Joule Heater Application

A Wearable All-Printed Textile-Based 6.78 MHz 15 W-Output Wireless Power Transfer System and Its Screen-Printed Joule Heater Application

Characterization of Embedded and Thinned RF Chips

Next-Generation IoT Devices: Sustainable Eco-Friendly Manufacturing, Energy Harvesting, and Wireless Connectivity

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