BGA Interconnection Reliability in Mirrored Module Configurations

Hagberg, J.; Putaala, Jussi; Raumanni, Juha; Salmela, Olli; Galkin, Timo

doi:10.1109/tcpmt.2017.2739204

Cited by 14 publications

(3 citation statements)

References 22 publications

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“…They also developed a failure model for BGA solder joints based on the life data. Hagberg et al [26] presented thermal cycling test results and simulation results of plastic ball grid array components mounted on one side and in different mirrored configurations on a circuit board. Zhang et al [27] predicted the fatigue life of BGA solder joint under random vibration from the perspectives of both model simulation and experimental tests.…”

Section: Introductionmentioning

confidence: 99%

Impact of ground solder ball failure in BGA package on near electric field radiation

Yuan

Zhang

Wang

et al. 2022

IEICE Electron. Express

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In this paper, the impact of ground solder ball failure in ball grid array (BGA) package on near electric field radiation was investigated from the perspectives of both theoretical modelling and experimental testing. Based on the structural and material parameters, a 3D electromagnetic field numerical calculation model of circuit boards with failed ground solder balls was developed. The influences of both different number of failed ground solder balls and different signal frequencies on near electric field radiation was calculated. The electromagnetic field model results are validated using experimental tests.

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Section: Introductionmentioning

confidence: 99%

Impact of ground solder ball failure in BGA package on near electric field radiation

Yuan

Zhang

Wang

et al. 2022

IEICE Electron. Express

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“…Moreover, Hagberg et al. 15 studied the reliability of plastic ball grid array (PBGA) under thermal cycling test in a temperature interval from −40 ℃ to 125 ℃. The effect of geometrical parameter of BGA package on the strain and stress of the solder joint was studied by Wang et al.…”

Section: Introductionmentioning

confidence: 99%

“…Chuang et al 14 established a numerical simulation model for reliability of BGA IC package subjected to temperature cycling. Moreover, Hagberg et al 15 studied the reliability of plastic ball grid array (PBGA) under thermal cycling test in a temperature interval from À40 C to 125 C. The effect of geometrical parameter of BGA package on the strain and stress of the solder joint was studied by Wang et al 16 The results showed that the reduction of radial size and the augmentation of the solder joint height lead to a decrease of the stress in the solder joint.…”

Section: Introductionmentioning

confidence: 99%

Modeling and experimentation of creep-fatigue and failure of low-profile quad flat package under thermal cycle

Halouani

Cherouat

Chaabane³

et al. 2020

Proceedings of the Institution of Mechanical Engineers, Part C:

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An experimental investigation and numerical modeling using multiphysics finite element method were performed to study the thermal failure mechanism of low-profile quad flat package solder joints of memory module due to low-cycle fatigue. The strain, stress, and number of cycles to failure have been calculated according to a strain life Coffin–Manson and energy-based Morrow fatigue models. Scanning electron microscopy imaging at the end of thermal cycle was used to evaluate the damage initiation and propagation. The effect of the solder volume on fatigue life of solder joints was discussed. Through analyses of theoretical results and experimental data on fatigue life, cracks initiation and propagation have been highlighted and their possible causes have been discussed.

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A review on numerical approach of reflow soldering process for copper pillar technology

Lee

Aziz

Ishak

et al. 2022

Int J Adv Manuf Technol

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BGA Interconnection Reliability in Mirrored Module Configurations

Cited by 14 publications

References 22 publications

Impact of ground solder ball failure in BGA package on near electric field radiation

Impact of ground solder ball failure in BGA package on near electric field radiation

Modeling and experimentation of creep-fatigue and failure of low-profile quad flat package under thermal cycle

A review on numerical approach of reflow soldering process for copper pillar technology

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