BGA substrate outgassing negative impact study on Cu wire bonding

Abstract

Purpose The purpose of this paper is to attempt to study the failure mechanism of BGA (ball grid array) Cu wire bond ball lift and specifically focused on substrate outgassing’s impact on Cu wire bonding quality and reliability. Design/methodology/approach The Galvanic corrosion theory has been widely adopted in explaining the failure mechanism of Cu ball bond lift issue during reliability test or field application in the presence of moisture. In this study, ion chromatography was performed on BGA substrate halogen analysis. EDX (energy-dispersive X-ray spectroscopy) was also used to detect the contaminant’s element at the bottom surface of a window clamp. Further FTIR (Fourier transform infrared spectroscopy) analysis verified that the contamination is from substrate outgassing during wire bonding. A new window clamp design proved effective in reducing the negative impact from substrate outgassing during wire bonding. Findings The solder mask in a fresh substrate contains a chlorine element. The chlorine can be detected in the BGA substrate outgassing during wire bonding by FTIR and EDX analyses, which have a negative impact on the Cu wire bonding. The window clamp with a larger opening can reduce the negative impact of the Cu wire bonding from the BGA substrate outgassing. Research limitations/implications Because of the limitation of time and resources, bonding pad surface contamination from substrate outgassing and its correlation with Cu bonding ball lift failure after reliability test will be studied in depth later. Originality/value The BGA substrate outgassing has negative impacts on Cu wire bondability. A window clamp with a larger opening can reduce the negative impact from substrate outgassing.

Review on Corrosion in Electronic Packaging Trends of Collaborative between Academia–Industry

“…In situ 2D maps of pH shifts across brass-lead galvanic joints using microelectrodes [114] Electrochemical behavior of Zn-xSn high-temperature solder alloys in 0.5 M NaCl solution [114] BGA substrate outgassing negative impact study on Cu wire bonding [59] Collaboration works in China between Tianjin University and NXP Semiconductor (China) Ltd. A novel technique for the connection of ceramic and titanium implant components using glass solder bonding [122] Collaboration works in Germany between University Medicine Rostock, Praxis fuer Zahnheilkunde, and ZM Praezisionsdentaltechnik GmbH.…”

Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees

“…It will become the mainstream research direction to realize the low-temperature soldering between the heat sink substrate and the metal substrate of the packaged chip (Yao et al , 2017; Shen et al , 2019; Bhogaraju et al , 2020). Although Cu has better electrical and thermal conductivity than Al (Zhang et al , 2017a; Zhang et al , 2017b), and the mismatch of coefficient of thermal expansion between Cu and Si is smaller than that between Al and Si, the replacement of Al by Cu is due to cost factors such as high material price and upgrading of production equipment, so in some cases, Cu cannot completely replace Al. Therefore, the joint obtained by soldering Cu and Al can completely integrate the advantages of the two components, aiming to effectively lower the production cost and achieve outstanding performance.…”