Bias electric field distribution analysis based on finite difference method with non-uniform grids for a non-contact tunneling current probe

Bian, Xingyuan; Cui, Junning; Lu, Yesheng; Tan, Jiubin

doi:10.1117/12.2512440

Cited by 1 publication

(2 citation statements)

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“…Considering the actual demand in industry, only holes of conductor material are discussed-although the analysis shows that non-conductor material can also be probed using the SSEP method with much worse resolution. The bias electrical field was theoretically modeled using the seven-point finite difference method and non-uniform meshing in a spherical coordinate system [18]. The Laplace equation was solved for a model consisting of a 3-mm conductor sphere as the probing ball and a conducting plane (yoz plane) as the surface to be measured.…”

Section: Spherical Scattering Electrical-field Probing Methodsmentioning

confidence: 99%

“…Therefore, the SSEP probe is capable of isotropic sensing and point-probing, both of which are ideal for the measurement of small holes with large depth-to-diameter ratios. The bias electrical field was theoretically modeled using the seven-point finite difference method and non-uniform meshing in a spherical coordinate system [18]. The Laplace equation was solved for a model consisting of a φ3-mm conductor sphere as the probing ball and a conducting plane (yoz plane) as the surface to be measured.…”

Section: Spherical Scattering Electrical-field Probing Methodsmentioning

confidence: 99%

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Ultraprecision Diameter Measurement of Small Holes with Large Depth-To-Diameter Ratios Based on Spherical Scattering Electrical-Field Probing

Bian

Cui

et al. 2019

Applied Sciences

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In order to solve the difficulty of precision measurement of small hole diameters with large depth-to-diameter ratios, a new measurement method based on spherical scattering electrical-field probing (SSEP) was developed. A spherical scattering electrical field with identical sensing characteristics in arbitrary spatial directions was formed to convert the micro gap between the probing-ball and the part being measured into an electrical signal. 3D non-contact probing, nanometer resolution, and approximate point probing—which are key properties for high measurement precision and large measurable depth-to-diameter ratios—were achieved. A specially designed hole diameter measuring machine (HDMM) was developed, and key techniques, including laser interferometry for macro displacement measurement of the probe, multi-degree-of-freedom adjustment of hole attitude, and measurement process planning, are described. Experiments were carried out using the HDMM and a probing sensor with a ϕ3-mm probing ball and a 150-mm-long stylus to verify the performance of the probing sensor and the measuring machine. The experimental results indicate that the resolution of the probing sensor was as small as 1 nm, and the expanded uncertainty of measurement result was 0.2 μm (k = 2) when a ϕ20-mm ring gauge standard was measured.

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Section: Spherical Scattering Electrical-field Probing Methodsmentioning

confidence: 99%

Section: Spherical Scattering Electrical-field Probing Methodsmentioning

confidence: 99%