Binding Conductive Ink Initiatively and Strongly: Transparent and Thermally Stable Cellulose Nanopaper as a Promising Substrate for Flexible Electronics

Yu, Huang; Fang, Dongjun; Dirican, Mahmut; Wang, Ruiping; Tian, Ye; Chen, Linlin; Liu, Hao; Wang, Jiasheng; Tang, Fangcheng; Asiri, Abdullah M.; Zhang, Xiangwu; Tao, Jinsong

doi:10.1021/acsami.9b04596

Cited by 36 publications

(30 citation statements)

References 51 publications

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“…The AgNP ink was prepared according to previously reported similar processes. [ 45 ] Silver nitrate (1.7 g) and polyvinyl pyrrolidone (PVP) (1 g) were dissolved in deionized (DI) water (100 mL). The mixture was kept stirring for 30 min at room temperature and a Ag‐PVP complex was obtained.…”

Section: Methodsmentioning

confidence: 99%

Highly Thermally Stable, Green Solvent Disintegrable, and Recyclable Polymer Substrates for Flexible Electronics

Chen

Dirican

et al. 2020

Macromol. Rapid Commun.

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Flexible electronics have been becoming more and more popular recently because of their unique features. But rapidly growing consumption of flexible electronics also causes increased amount of electronic solid waste due to their relatively short lifetime as well as the non-recyclable materials they are made of. [1,2] In nearly all forms of commercial flexible electronics, polymer substrates are indispensable base materials that provide foundationally mechanical support to the devices. Unfortunately, most polymer substrates are particularly difficult to be disintegrated and recycled since their complex structures are initially designed to achieve high robustness and survivability, but not for high recyclability. [3-5] The neglected recyclability of polymer substrates leads to more environmental contamination surrounding us. [6,7] Thus, recyclability of polymer substrates used in flexible electronics has become a meaningful and urgent issue in consideration of reducing electronic solid waste generation and pollution. The recyclability of polymer substrates is closely related to their material type and chemical structure. In recent years, many different polymers have been identified as suitable substrate materials for fabrication of flexible electronics. Since conductive metal layers need to be fabricated directly on polymer substrates via various temperature-assisted processes such as soldering, sintering, annealing, sputtering, or evaporating, the polymer substrates must have adequate thermal stability to withstand heat-induced deformation. [8] Typically, thermally stable polymers such as polyimide (PI), polyarylates (PAR), polycarbonate (PC), poly(ether sulfone) (PES), polyethylene (PEN), and liquid crystal polymer(LCP) are favorable in this application. [9-12] These polymer substrates have sufficient thermal stability to withstand distortion due to their distinctive structure of rigid and conjugated backbone, high crystallinity, and high crosslinking. On the other hand, thermally stable polymers are also difficult to be disintegrated or dissolved by common organic solvents or green solvents. As a result, toxic organic solvents such as dimethyl sulphoxide (DMSO) are used to disintegrate or dissolve these polymer substrates during Flexible electronics require its substrate to have adequate thermal stability, but current thermally stable polymer substrates are difficult to be disintegrated and recycled; hence, generate enormous electronic solid waste. Here, a thermally stable and green solvent-disintegrable polymer substrate is developed for flexible electronics to promote their recyclability and reduce solid waste generation. Thanks to the proper design of rigid backbones and rational adjustments of polar and bulky side groups, the polymer substrate exhibits excellent thermal and mechanical properties with thermal decomposition temperature (T d,5%) of 430 °C, upper operating temperature of over 300 °C, coefficient of thermal expansion of 48 ppm K −1 , tensile strength of 103 MPa, and elastic modulus of 2.49 GPa. F...

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Section: Methodsmentioning

confidence: 99%

Highly Thermally Stable, Green Solvent Disintegrable, and Recyclable Polymer Substrates for Flexible Electronics

Chen

Dirican

et al. 2020

Macromol. Rapid Commun.

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Section: Electronic Devices Based On Flexible Porous Substratesmentioning

confidence: 99%

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confidence: 99%

A New Class of Electronic Devices Based on Flexible Porous Substrates

Zhang

Huang

et al. 2022

Advanced Science

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With the advent of the Internet of Things era, the connection between electronic devices and humans is getting closer and closer. New‐concept electronic devices including e‐skins, nanogenerators, brain–machine interfaces, and implantable medical devices, can work on or inside human bodies, calling for wearing comfort, super flexibility, biodegradability, and stability under complex deformations. However, conventional electronics based on metal and plastic substrates cannot effectively meet these new application requirements. Therefore, a series of advanced electronic devices based on flexible porous substrates (e.g., paper, fabric, electrospun nanofibers, wood, and elastic polymer sponge) is being developed to address these challenges by virtue of their superior biocompatibility, breathability, deformability, and robustness. The porous structure of these substrates can not only improve device performance but also enable new functions, but due to their wide variety, choosing the right porous substrate is crucial for preparing high‐performance electronics for specific applications. Herein, the properties of different flexible porous substrates are summarized and their basic principles of design, manufacture, and use are highlighted. Subsequently, various functionalization methods of these porous substrates are briefly introduced and compared. Then, the latest advances in flexible porous substrate‐based electronics are demonstrated. Finally, the remaining challenges and future directions are discussed.

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“…In recent years, a variety of environment-friendly, bio-degradable, and low-cost electronic products have emerged 17,18 , which were made of materials from nature, including cellulose [19][20][21][22][23][24] , lignin [25][26][27][28][29] , proteins [30][31][32] , and starch [33][34][35] . These materials from nature have intrinsic advantages of abundant sources, low cost, good degradability, acceptable biocompatibility, fine accessibility for chemical modification comparing with synthesized polymers.…”

Section: Introductionmentioning

confidence: 99%

Green flexible electronics based on starch

Xiang

Liu

et al. 2022

npj Flex Electron

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Flexible electronics (FEs) with excellent flexibility or foldability may find widespread applications in the wearable devices, artificial intelligence (AI), Internet of Things (IoT), and other areas. However, the widely utilization may also bring the concerning for the fast accumulation of electronic waste. Green FEs with good degradability might supply a way to overcome this problem. Starch, as one of the most abundant natural polymers, has been exhibiting great potentials in the development of environmental-friendly FEs due to its inexpensiveness, good processability, and biodegradability. Lots of remarks were made this field but no summary was found. In this review, we discussed the preparation and applications of starch-based FEs, highlighting the role played by the starch in such FEs and the impacts on the properties. Finally, the challenge was discussed and the outlook for the further development was also presented.

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Binding Conductive Ink Initiatively and Strongly: Transparent and Thermally Stable Cellulose Nanopaper as a Promising Substrate for Flexible Electronics

Cited by 36 publications

References 51 publications

Highly Thermally Stable, Green Solvent Disintegrable, and Recyclable Polymer Substrates for Flexible Electronics

Highly Thermally Stable, Green Solvent Disintegrable, and Recyclable Polymer Substrates for Flexible Electronics

A New Class of Electronic Devices Based on Flexible Porous Substrates

Green flexible electronics based on starch

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