Biocompatible packaging for implantable miniaturized pressure sensor device used for stent grafts: Concept and choice of materials

Kirsten, Sabine; Schubert, M.; Braunschweig, Markus; Woldt, Gregor; Voitsekhivska, Tetiana; Wolter, Klaus‐Jürgen

doi:10.1109/eptc.2014.7028327

Cited by 16 publications

(10 citation statements)

References 10 publications

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“…This technique involves the placement of an expandable stent graft within the aorta (Kim, Yim, Kim, Kang, & Lee, 2019). Kirsten et al, (2014) developed a flexible, miniaturized and wireless implantable pressure sensor to be connected to a stent graft to monitor the pressure distribution within an aneurysm ( Figure 6). Biocompatible packaging methodologies using different flexible polymeric materials including polyimide, PDMS and parylene-C were developed and evaluated.…”

Section: Microelectrode Arraysmentioning

confidence: 99%

“…Copyright © 2016 IEEE F I G U R E 6 Top: Schematic diagram of EVAR stent graft equipped with four sensor devices providing continuous pressure monitoring within the aneurysm as well as a wireless power and data transmission. Bottom: Prototype of flexible pressure sensor device with four pressure sensors, passive components for wireless power and data transmission and an ASIC mounted on the flexible substrate described by Kirsten et al (2014). Reprinted with permission from Kirsten et al (2014).…”

Section: Accelerometersmentioning

confidence: 99%

“…Bottom: Prototype of flexible pressure sensor device with four pressure sensors, passive components for wireless power and data transmission and an ASIC mounted on the flexible substrate described by Kirsten et al (2014). Reprinted with permission from Kirsten et al (2014). Copyright © 2014 IEEE Therefore, the metal traces in the multilayer substrate were well protected.…”

Section: Accelerometersmentioning

confidence: 99%

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Non‐hermetic packaging of biomedical microsystems from a materials perspective: A review

et al. 2020

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Traditionally, implantable electronic devices have used metal-based hermetic encapsulation to protect the internal components from damage by the aggressive in vivo environment. Concurrently, hermetic encapsulation protects the surrounding tissue from harmful substances that might be leached from the packaged components (Bazaka & Jacob, 2012). In some cases, however, there is risk of electrochemical corrosion on the metallic surfaces because of the presence of various ions, amino acids, proteins and dissolved oxygen (Eliaz, 2019). Hermeticity is defined as the ability of sealed packages to resist foreign gases and liquids from penetrating the seal or encapsulating material (Madduri, Sammakia, Infantolino, & Chaparala, 2008). Hermetic packages are conventionally made from glass, metal or ceramic materials whereby the gas and moisture permeability through the material is negligible (Madduri et al., 2008; Schuettler, Schatz, Ordonez, & Stieglitz, 2011). Hermetic materials have been successfully used to package devices for chronic applications, some of the most notable being cochlear implants and cardiac pacemakers (Kirsten, Wetterling, Uhlemann, Wolter, & Zigler, 2013). Titanium is the most commonly used metal for hermetic encapsulation because of its biocompatibility, low permeability for ions and moisture, mechanical durability and the ability to create viable hermetic seals by laser welding (Amanat, James, & McKenzie, 2010). Ceramics have also been used for implants for wireless devices to address issues related to attenuation of electromagnetic transmission by metallic packaging (El Khatib, Pothier, Crunteanu, & Blondy, 2007; Schubring & Fujita, 2007; Shen & Maharbiz, 2019). Driven by the increased functionality and scalability offered by innovations in application-specific integrated circuits (ASICs) and the desire to create highly miniaturized devices on flexible polymer substrates, significant efforts have been made in creating miniaturized implants by integrating the majority of components on a single chip. As the

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Section: Microelectrode Arraysmentioning

confidence: 99%

Section: Accelerometersmentioning

confidence: 99%

Section: Accelerometersmentioning

confidence: 99%

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Non‐hermetic packaging of biomedical microsystems from a materials perspective: A review

et al. 2020

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“…After filling silicone gel around the bonded pressure sensor, a polymer has been laminated to seal the pressure sensor. A biocompatible silicone gel links the same with the thinned substrate layer in order to transfer the pressure within the aneurysm to the sensitive area of the sensor as shown in Figure 1 b [ 19 ]. The flip-chip technology has been used to ensure miniaturization and flexibility of the device, compared to the commonly used wire bonding.…”

Section: Introductionmentioning

confidence: 99%

Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability Simulation

Seok

2021

Micromachines

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Polymer materials attract more and more interests for a biocompatible package of novel implantable medical devices. Medical implants need to be packaged in a biocompatible way to minimize FBR (Foreign Body Reaction) of the implant. One of the most advanced implantable devices is neural prosthesis device, which consists of polymeric neural electrode and silicon neural signal processing integrated circuit (IC). The overall neural interface system should be packaged in a biocompatible way to be implanted in a patient. The biocompatible packaging is being mainly achieved in two approaches; (1) polymer encapsulation of conventional package based on die attach, wire bond, solder bump, etc. (2) chip-level integrated interconnect, which integrates Si chip with metal thin film deposition through sacrificial release technique. The polymer encapsulation must cover different materials, creating a multitude of interface, which is of much importance in long-term reliability of the implanted biocompatible package. Another failure mode is bio-fluid penetration through the polymer encapsulation layer. To prevent bio-fluid leakage, a diffusion barrier is frequently added to the polymer packaging layer. Such a diffusion barrier is also used in polymer-based neural electrodes. This review paper presents the summary of biocompatible packaging techniques, packaging materials focusing on encapsulation polymer materials and diffusion barrier, and a FEM-based modeling and simulation to study the biocompatible package reliability.

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“…This outstanding set of properties make polyimide suitable for a variety of applications ranging from electronics, medicine, membrane separation to aerospace and military industries [81,84]. Certain types of biocompatible polyimides are widely used in the packaging of implantable electronics and electrodes not only for its barrier performance [85][86][87][88][89][90][91][92][93] but also for its compatibility with microfabrication processes, being used as a structural component of devices [94][95][96][97].…”

Section: Introductionmentioning

confidence: 99%

Investigating the Nucleation of AlOx and HfOx ALD on Polyimide: Influence of Plasma Activation

et al. 2021

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There is an increasing interest in atomic layer deposition (ALD) on polymers for the development of membranes, electronics, (3D) nanostructures and specially for the development of hermetic packaging of the new generation of flexible implantable micro-devices. This evolution demands a better understanding of the ALD nucleation process on polymers, which has not been reported in a visual way. Herein, a visual study of ALD nucleation on polymers is presented, based on the different dry etching speeds between polymers (fast) and metal oxides (slow). An etching process removes the polyimide with the nucleating ALD acting as a mask, making the nucleation features visible through secondary electron microscopy analyses. The nucleation of both Al2O3 and HfO2 on polyimide was investigated. Both materials followed an island-coalescence nucleation. First, local islands formed, progressively coalescing into filaments, which connected and formed meshes. These meshes evolved into porous layers that eventually grew to a full layer, marking the end of the nucleation. Cross-sections were analyzed, observing no sub-surface growth. This approach was used to evaluate the influence of plasma-activating polyimide on the nucleation. Plasma-induced oxygen functionalities provided additional surface reactive sites for the ALD precursors to adsorb and start the nucleation. The presented nucleation study proved to be a straightforward and simple way to evaluate ALD nucleation on polymers.

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Biocompatible packaging for implantable miniaturized pressure sensor device used for stent grafts: Concept and choice of materials

Cited by 16 publications

References 10 publications

Non‐hermetic packaging of biomedical microsystems from a materials perspective: A review

Non‐hermetic packaging of biomedical microsystems from a materials perspective: A review

Polymer-Based Biocompatible Packaging for Implantable Devices: Packaging Method, Materials, and Reliability Simulation

Investigating the Nucleation of AlOx and HfOx ALD on Polyimide: Influence of Plasma Activation

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