2011
DOI: 10.1016/j.medengphy.2010.08.010
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BION microstimulators: A case study in the engineering of an electronic implantable medical device

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Cited by 67 publications
(50 citation statements)
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“…Recent work has shown that flexible electronics can be placed into 3D structures through surgical processes 9-12 or by being attached to and subsequently released from a rigid delivery substrates 13-14 for biological and biomedical applications. However, direct 3D interpenetration of electronics within these structures is limited by the intrinsic thin-film 14 supporting substrates.…”
mentioning
confidence: 99%
“…Recent work has shown that flexible electronics can be placed into 3D structures through surgical processes 9-12 or by being attached to and subsequently released from a rigid delivery substrates 13-14 for biological and biomedical applications. However, direct 3D interpenetration of electronics within these structures is limited by the intrinsic thin-film 14 supporting substrates.…”
mentioning
confidence: 99%
“…However, the extra space this will require is very disadvantageous. A second way would be to use multichannel systems formed from isolated single channels, as is the case for the BION [11,14]. This approach may be attractive when there are several widely-separated stimulation sites or for systems requiring only few channels.…”
Section: Discussionmentioning
confidence: 99%
“…D and C sh are input parameters. The effective solutions of α can be obtained with (5) and then all the parameters can be calculated with the equations above. So, D and C sh need to be optimized.…”
Section: Relationship Among the Parametersmentioning
confidence: 99%