In this article, we display the fabrication methods and characterizations of the ITO/TiO 2 /Pt resistive random access memory (RRAM). By transmission electron microscopy (TEM) analysis, the fabricated TiO 2 thin film of our RRAM device was confirmed to be amorphous instead of other common crystal direction. The RRAM here shows bipolar resistive switching characteristic for over a hundred times switching cycles with a resistance ratio (R HRS /R LRS ) of more than 1 order and high stable retention characteristic for over 10 4 seconds with a resistance ratio (R HRS /R LRS ) of around 2 orders. We found that conduction mechanism was dominated only by ohmic conduction in both set and reset procedure. The set and reset voltage of the ITO/amorphous TiO 2 (a-TiO 2 )/Pt of this article were around 0.6 and -0.5 V, make it state-of-the-art in low operation voltage application. Over the past few decades the applications of nonvolatile memories (NVMs) have become widespread in computer, communication, and consumer electronics products. However, with the development of integrated circuits fabrication technologies and the size scaling down of semiconductor components, traditional floating gate memories fabrication had reached their physical limitations.1-3 In order to solve this topic, some NVMs such as ferroelectric random access memories (FeRAMs), 4-6 phase change random access memory (PCRAMs), [7][8][9][10] magnetoresistive random access memories (MRAMs), 11-14 and resistive random access memories (RRAMs) [15][16][17][18][19] have been investigated. Among these memories, RRAM device has attracted considerable attentions for its amazing characteristics, like casual device structure, low operating power consumption, high switching speed, and high integrating density, make it possible for RRAM to be the next generation NVM. RRAM, with uncomplicated structure, has been widely investigated because of the feasibility to integrate with conventional complementary metal-oxide-semiconductor (CMOS) devices. has attracted lots of interest for its high resistance difference between the high resistance state (HRS) and low resistance state (LRS). The resistive switching (RS) mechanism of RRAM is the formation and rupture of conductive filament paths within the thin film by the thermal effect. These conductive paths are related to the movement of oxygen vacancies and oxygen ions inside the solid oxides layer. The filament model of oxygen vacancies migration is used to explain the resistive switching behavior during the set/reset procedure of RRAM devices. There were microscopic evidence proposed to quantify both unipolar and bipolar resistive switching characteristics of transition metal oxide-based RRAM, which are correlated with the distribution of localized oxygen vacancies in the oxide layer. 34 There were reports of different electrode materials used to improve the resistive switching characteristics. 35,36 Take ITO for example, there were fabricated RRAM device took ITO material as electrodes. It had been shown that the resistive swi...