Board design optimization for fine pitch BGA components

Géczy, Attila; Illyefalvi‐Vitéz, Zsolt

doi:10.1109/estc.2010.5642918

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Fem Analyses Validation1

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2010

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“…The process of PCB manufacturing was supervised, inspected and optimized [9]. Over etching of a circuit trace is one of the problems that may occur when producing printed circuit boards with fine pitch.…”

Section: Fem Analyses Validationmentioning

confidence: 99%

Investigating PCB traces for fine pitch applications

Géczy

Illyefalvi‐Vitéz

2010

2010 IEEE 16th International Symposium for Design and Technology in Electronic Packaging (SIITME)

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Surface mounted (SM) components are considered to be dominant in electronics technology. Fine pitch SM components are becoming common due to miniaturization tendencies. Ball Grid Array (BGA) components are classified as fine pitch, if the pitch is 1 mm (39 mil) or smaller [1]. These ICs desire careful approach in Printed Circuit Board (PCB) design. In order to compare the electrical performance of PCBs, two PCB interconnection boards were designed with different wiring patterns for a 650 P Pm pitch commercial BGA. A footprintcompatible dummy BGA was also designed, produced and used to form daisy chain with the PCB patterns. The inductance of the different geometries of the traces on the PCBs and the resistance -varying according to the skin effect at higher frequencies [2] -were calculated and verified by measurements. The skin effect was simulated by Finite Element Method (FEM). The influence of the PCB fabrication deviations was also studied.

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Section: Fem Analyses Validationmentioning

confidence: 99%