2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) 2022
DOI: 10.1109/eptc56328.2022.10013257
|View full text |Cite
|
Sign up to set email alerts
|

Board Level Life Assessment of Large Body Flip Chip Packages with Smaller Solder ball pitch & Methodologies to improve Board level Reliability

Anandan Ramasamy1,
Inderjit Singh2,
Ace Ng3
et al.
Help me understand this report

This publication either has no citations yet, or we are still processing them

Set email alert for when this publication receives citations?

See others like this or search for similar articles

scite logo

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

Product
Browser ExtensionAssistant by sciteCitation Statement SearchReference CheckVisualizationsDashboardsExplore JournalsExplore OrganizationsExplore FundersEmbedding BadgeEmbedding Citation SearchPricing
Resources
BlogHelp & FAQAccessibility StatementAPI TermsFor Universities & GovernmentsFor ResearchersFor PublishersFor Corporate, Pharma & EnterpriseAuthor MarketingBecome an AffiliateGet an organization trial or quotescite Data & Services
About
News & PressCareersRead our PaperCoverage

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

BlogTerms and ConditionsAPI TermsPrivacy PolicyContactCookie PreferencesDo Not Sell or Share My Personal Information

Copyright © 2024 scite LLC. All rights reserved.

Made with 💙 for researchers

Part of the Research Solutions Family.