Board level reliability of the advanced RF power packaging

High Power RF electronics is one of the essential parts for wireless communication, including the personal communication, broadcasting, microwave radar, etc. Moreover, high efficient high power electronics has entered the ISM market, such as the power generator of microwave oven. Power electronics requires a close co-development of digital-analog mixed circuit design, high power IC manufacturing technologies, and high power packaging design/process, in order to guarantee their performance and lifetime. In this paper, we overviewed our works on the packaging/assembly development of high power packages, including three parts: (1) Thermal simulation and die bond defect control (2) Mechanical integrity model for soft package heatsink implementation (3) Al wire multiphysics modeling and reliability of plastic power package.

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Board level reliability of the advanced RF power packaging

Cited by 3 publications

References 1 publication

Modelling aluminium wire bond reliability in high power OMP devices

Modelling aluminium wire bond reliability in high power OMP devices

High power electronics package: From modeling to implementation

Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging

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