Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications

Tee, Tong Yan; Ng, Hun Shen; Yap, D.; Baraton, Xavier; Zhong, Zhang

doi:10.1016/s0026-2714(03)00127-6

Cited by 76 publications

(42 citation statements)

References 7 publications

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“…The die thickness used for this comparison is 0.25 mm. The relative trend of the effect of PCB thickness is similar as the results of TGBGA packages [30], QFN packages [31] and stack die BGA packages [32,32].…”

Section: Effect Of Pcb Thicknesssupporting

confidence: 72%

Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)

Zhang

Kripesh

Chai

et al. 2008

Microelectronics Reliability

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Section: Effect Of Pcb Thicknesssupporting

confidence: 72%

Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)

Zhang

Kripesh

Chai

et al. 2008

Microelectronics Reliability

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“…[4][5][6][7][8][9][10][11], it can be seen that the growth rate of both Ag in Sn and Cu in Sn is bigger than other phases. That is why the phases Cu 6 Sn 5 and Ag 3 Sn are bigger than other phases.…”

Section: Evolvement Of Microstructure Of Solder Jointsmentioning

confidence: 96%

“…The reliability of SMT solder joints is now more important than before Supported by Astronautic Technology Innovation Fund because only one solder joint's failure may cause a catastrophic result and give a serious worldwide influence. However, there has been little study on the solder joints' reliability in this serious condition although a lot of papers have been done in some kinds of thermal cycle load or in some kind of vibration/shock condition or in thermal-mechanical load [1][2][3][4][5][6][7][8][9][10]. These studies, although, may give some guidance to astronautic solder joints' reliability, they are not adapted to evaluate astronautic solder joints' reliability accurately.…”

Section: Introductionmentioning

confidence: 99%

Astronautic PBGA (plastic ball grid array) solder joints’ reliability: under successive-high acceleration shock condition

Guo

Zhao

Zhu

et al. 2005

Int J Adv Manuf Technol

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Along with the development of the astronautic industry, more and more SMT solder joints have been used in missile, rocket and other important equipments where the environment of astronautic equipments is more serious and complex than that in normal conditions. In this present paper, reliability of a kind of astronautic PBGA256 assembly sample is considered under the successive-high acceleration shock condition. During the test, the thickness of InterMetal Compounds (IMCs) is considered and calculated by an equation to compare with each other. It is found that the growth rate of the phase of Cu 6 Sn 5 /Cu 3 Sn and Ag 3 Sn is larger that other phases. So in the finial micrographs the phase of Cu 6 Sn 5 /Cu 3 Sn and Ag 3 Sn is easy to observed. After 3 hours' successive-high acceleration (7g) shock, although the sample PBGA solder joints are still in good condition and have no obvious crack by SEM, in the micrograph of the solder joint there are some special phenomena that is not the same as that in normal condition or thermal fatigue load.

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“…Motivated by this fact, cohesive zone based interfacial fatigue damage models were characterized by inverse modeling through dedicated fatigue experiments Erinc et al 2004Erinc et al , 2005Erinc et al , 2008. Fatigue life predictions for BGA or flip-chip sol- der balls are generally conducted using Coffin-Manson, J-integral, power law or creep models (Tchankov et al 2008;Desai et al 1998;Li and Wang 2007;Tee et al 2003;Zhang et al 2008). In Towashiraporn et al (2005), the fatigue crack trajectory and fatigue life of a solder joint is predicted through a coupled numericalexperimental approach.…”

Section: Introductionmentioning

confidence: 99%

Fatigue fracture of SnAgCu solder joints by microstructural modeling

et al. 2008

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The ongoing miniaturization trend in the microelectronic industry enforces component sizes to approach the micron, or even the nano scale. At these scales, the underlying microstructural sizes and the geometrical dimensions are comparable. The increasing influence of microscopic entities on the overall mechanical properties makes conventional continuum material models more and more questionable. In this study, the thermomechanical reliability of lead-free BGA solder balls is investigated by microstructural modeling. Microstructural input is provided by orientation imaging microscopy (OIM), converted into a finite element framework. Blowholes in BGA solder balls are examined by optical microscopy and a statistical analysis on their size, position and frequency is conducted. Combining the microstructural data with the appropriate material models, three dimensional local models are created. The fatigue life of the package is determined through a critical solder ball. The thermomechanical reliability of the local models are predicted using cohesive zone based fatigue damage models. The simulation results are validated by statistical analyses provided by the industry.

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Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications

Cited by 76 publications

References 7 publications

Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)

Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP)

Astronautic PBGA (plastic ball grid array) solder joints’ reliability: under successive-high acceleration shock condition

Fatigue fracture of SnAgCu solder joints by microstructural modeling

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