Board-Level Vibration Failure Criteria for Printed Circuit Assemblies: An Experimental Approach

Amy, Robin Alastair; Aglietti, Guglielmo S.; Richardson, Guy

doi:10.1109/tepm.2010.2084092

Cited by 10 publications

(3 citation statements)

References 19 publications

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“…The comparison of natural frequencies determined with both methods showed that the mass of the accelerometer had no significant influence on the results. Once the experimental modal deflection is obtained, the chosen method to assess damage in the critical solder ball consists in evaluating the local board curvature next to the critical solder joint [9][10][11]. The determination of the uniaxial deflection equation for a simple PCB (without any component) is straightforward using the boundary conditions of the system (2).…”

Section: B Test Procedures and Matrixmentioning

confidence: 99%

Mechanical fatigue assessment of SAC305 solder joints under harmonic vibrations

Libot

Arnaud

Dalverny

et al. 2016

2016 International Conference on Electronics Packaging (ICEP)

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Vibration-induced solder joint fatigue is a main reliability concern for aerospace and military industries whose electronic equipment used in the field is required to remain functional under such loading. Due to the RoHS directive which eventually will prevent lead from being utilized in electronic systems, there is a need for a better understanding of lead-free mechanical behavior under vibration conditions. This study reports the durability of Sn3.0Ag0.5Cu (SAC305) solder joints subjected to harmonic solicitations at three specific temperatures (-55°C, 20°C and 105°C). A test assembly is designed and consists in a single daisy-chained 1152 I/O ball grid array (FBGA1152) package assembled on a flame retardant (FR-4) printed circuit board (PCB). The vibration levels are imposed by a controlled deflection at the center of the board at its natural frequency. The electric continuity is monitored to determine the number of cycles to failure of each sample. Mode shape measurements with a scanning vibrometer are also conducted and correlated with Finite Element Analysis (FEA) to ensure accurate calculation of stress within the critical solder balls at the corners of the component. The failed specimens are then cross-sectioned in order to determine failure modes. A comparison of SAC305 durability with SnPb36Ag2 solder is given, along with a set of lifetime measurements for two complementary assemblies: 68 I/O Leadless Chip Carrier (LCC68) and 324 I/O Plastic Ball Grid Array (PBGA324). It turns out that SAC305 outperforms SnPb36Ag2 and the effect of temperature on the mechanical durability of SAC305 appears to be minor. Failure analysis points out different failure modes such as ductile and brittle cracks at the interface between the solder bulk and the component, along with pad cratering-induced copper trace failures. FEA calculations provide data to estimate the high cycle fatigue (HCF) behavior of SAC305 solder under harmonic vibrations.

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Section: B Test Procedures and Matrixmentioning

confidence: 99%

Mechanical fatigue assessment of SAC305 solder joints under harmonic vibrations

Libot

Arnaud

Dalverny

et al. 2016

2016 International Conference on Electronics Packaging (ICEP)

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“…Such applications particularly experience strong mechanical loadings such as vibrations and impacts, and the problems exhibit high complexity due to multiple involvements of mechanics and physics phenomena [5,6].…”

Section: Introductionmentioning

confidence: 99%

PBGA packaging reliability assessments under random vibrations for space applications

Kim

Hwang

2015

Microelectronics Reliability

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“…Many studies have been carried out with detailed finite element (FE) models, where the complexity of these models is justified [1][2][3][4]. However, the long time required to build and solve the models cannot be justified when only the PCB response is required.…”

Section: Introductionmentioning

confidence: 99%

Printed Circuit Board vibration analysis using simplified finite element models

Burmitskih

Lebedev

Levitskiy

et al. 2013

2013 International Siberian Conference on Control and Communications (SIBCON)

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Vibration and shock loadings can lead to an operating mode violation of the electronic equipment, Printed Circuit Board (PCB) and electronic components failure. A major difficulty with PCB vibration response prediction is caused by influence of electronic components, as the components effectively increase the mass and stiffness of the PCB. The problem can be solved by using simplified method based on addition the mass and stiffness of the components to the PCB model. This work developed a methodology of PCB vibration analysis using simplified finite element models.

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Board-Level Vibration Failure Criteria for Printed Circuit Assemblies: An Experimental Approach

Cited by 10 publications

References 19 publications

Mechanical fatigue assessment of SAC305 solder joints under harmonic vibrations

Mechanical fatigue assessment of SAC305 solder joints under harmonic vibrations

PBGA packaging reliability assessments under random vibrations for space applications

Printed Circuit Board vibration analysis using simplified finite element models

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