Bond formation and fiber embedment during ultrasonic consolidation

Quantitative Evaluation of Bulk and Interface Microstructures in Al-3003 Alloy Builds Made by Very High Power Ultrasonic Additive Manufacturing

“…Therefore, this process is expected to be a powerful tool for many applications such as composite parts, dies, embedded sensors, and so on, which have complicated structures. Recent publications [1][2][3][4][5][6][7][8][9][10][11][12][13][14] showed that the bonding process between tapes progresses through many metallurgical phenomena including plastic deformation, frictional heating, deformation heating, recrystallization, diffusion, and contact between nascent surfaces. However, all the preceding works have focused on representative interfaces extracted from these builds.…”

“…The role of welding parameters (speed, normal force, and oscillation amplitude) on bonding were investigated by many researchers using microscopy [3][4][5][6][7][8][9][10][11][12][13] and mechanical property testing. These investigations focused on minimization of void fraction [3,[7][8][9][10]12] at interfaces due to inefficient solid-state joining.…”

Multifunctional metal matrix composites with embedded printed electrical materials fabricated by ultrasonic additive manufacturing

“…This acts to minimise potential thermal damage to vulnerable embedded components [17]. Secondly, a relatively large plastic metal flow, driven by ultrasonic welding, allows the fully embedding of functional components [18]. To date, various elements such as shape memory alloy (SMA) fibers [19][20][21][22], optical fibres [23,24], prepackaged electronic systems [25], direct-written circuitries [26], magnetostrictive Galfenol [20-M A N U S C R I P T A C C E P T E D ACCEPTED MANUSCRIPT 3 22], electroactive PVDF film [21], and electrical switches made of shape memory nickel-titanium (Ni-Ti) [27] have been successfully embedded within UAM metal components.…”

The effect of ultrasonic excitation on the electrical properties and microstructure of printed electronic conductive inks

“…A high degree of material plastic flow is encountered during the welding process, as well as various surface and volume effects, such as stick-slip phenomena at the welding interface and acoustic softening on the volume of the material [1]. The temperature developed during UAM has been experimentally measured by placing a thermocouple between two layers of foil for relatively low levels of oscillation amplitude [2], and with an infrared camera for higher levels of amplitude [3]. Both studies reported temperatures considerably lower than the melting point of aluminium: under 100 o C on the first case and less than 250 o C on the later.…”