Bond shear strength of Al2O3 nanoparticles reinforced 2220-capacitor/SAC305 solder interconnects reflowed on bare and Ni-coated copper substrate

Tikale, Sanjay; Prabhu, K. Narayan

doi:10.1007/s10854-020-05040-9

Cited by 7 publications

(4 citation statements)

References 56 publications

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“…The metallurgical reaction of Cu and Sn results in the formation of Cu 6 Sn 5 and Cu 3 Sn IMC at the solder bump/Cu pillar interface. After reflow, Cu 6 Sn 5 is formed in accordance with the reactions ( 12) and ( 13) [98]: 6Cu + 5Sn → Cu 6 Sn 5 (12) 2Cu 3 Sn + 3Sn → Cu 6 Sn 5 .…”

Section: Reliability Of Solder Bump and Future Directionsmentioning

confidence: 97%

A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process

Cho

Seo

Kim

et al. 2021

Metals

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With the continuous miniaturization of electronic devices and the upcoming new technologies such as Artificial Intelligence (AI), Internet of Things (IoT), fifth-generation cellular networks (5G), etc., the electronics industry is achieving high-speed, high-performance, and high-density electronic packaging. Three-dimensional (3D) Si-chip stacking using through-Si-via (TSV) and solder bumping processes are the key interconnection technologies that satisfy the former requirements and receive the most attention from the electronic industries. This review mainly includes two directions to get a precise understanding, such as the TSV filling and solder bumping, and explores their reliability aspects. TSV filling addresses the DRIE (deep reactive ion etching) process, including the coating of functional layers on the TSV wall such as an insulating layer, adhesion layer, and seed layer, and TSV filling with molten solder. Solder bumping processes such as electroplating, solder ball bumping, paste printing, and solder injection on a Cu pillar are discussed. In the reliability part for TSV and solder bumping, the fabrication defects, internal stresses, intermetallic compounds, and shear strength are reviewed. These studies aimed to achieve a robust 3D integration technology effectively for future high-density electronics packaging.

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Section: Reliability Of Solder Bump and Future Directionsmentioning

confidence: 97%

A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process

Cho

Seo

Kim

et al. 2021

Metals

View full text Add to dashboard Cite

show abstract

“…At the Cu/solder interface, Cu and Sn react in the solid state to form Cu 6 Sn 5 and Cu 3 Sn IMC at the interface. Reactions (4) and ( 5) after reflow lead to the production of Cu 6 Sn 5 [300]…”

Section: Reliability Of Tsv Solder Joints and Future Directionsmentioning

confidence: 99%

Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review

Jang,

Sharma,

Jung

2023

Materials

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Three-dimensional (3D) packaging using through-Si-via (TSV) is a key technique for achieving high-density integration, high-speed connectivity, and for downsizing of electronic devices. This paper describes recent developments in TSV fabrication and bonding methods in advanced 3D electronic packaging. In particular, the authors have overviewed the recent progress in the fabrication of TSV, various etching and functional layers, and conductive filling of TSVs, as well as bonding materials such as low-temperature nano-modified solders, transient liquid phase (TLP) bonding, Cu pillars, composite hybrids, and bump-free bonding, as well as the role of emerging high entropy alloy (HEA) solders in 3D microelectronic packaging. This paper serves as a guideline enumerating the current developments in 3D packaging that allow Si semiconductors to deliver improved performance and power efficiency.

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“…Although it has been reported that the higher the peak intensity of phases in a coating, the more the stability of the coating and the less the microstructure lattice defects [40]. However, there are indications that the UPP nanoparticles could probably have suppressed the growth of MgO in the matrix of Zn-20MgO-6UPP coating to refine the grains [41][42][43]. Hence, the peak could also contain some out of sight elements that are not captured with the crystal.…”

Section: Figure 3 Polarization Curves For the As-received And Coated ...mentioning

confidence: 99%

Exploration of the effect of Zn-MgO-UPP coating on hardness, corrosion resistance and microstructure properties of mild steel

Akande

Fayomi

Akpan

et al. 2022

J. Electrochem. Sci. Eng.

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This paper investigated the effect of unripe plantain peel (UPP) nanoparticles reinforced Zn-MgO composite coating on the hardness, anti-corrosion and microstructure properties of mild steel. The anti-corrosion characteristics of the coatings were examined using the potentiodynamic polarization method, employing 3.65 % NaCl solution as the test medium. The hardness of the coatings was studied employing the Brinell hardness technique, while the microstructure characteristics were examined using XRD and SEM/EDS. The results of the study revealed that the as-received mild steel sample exhibited the corrosion rate and hardness value of 8.6272 mm year-1 and 136.8 kgf mm-2, respectively, while the Zn-MgO coated mild steel sample exhibited a corrosion rate and hardness value of 242.5 kgf mm-2 and 3.6362 mm year-1, respectively. The optimal performing Zn-MgO-UPP coated mild steel sample (sample coated with 20 g L-1 of MgO and 6 g L-1 of UPP) exhibited a corrosion rate and hardness value of 0.8317 mm year-1 and 245.8 kgf mm-2, respectively. The corrosion rate and hardness value of the Zn-20MgO-6UPP coated mild steel sample indicated that the UPP nanoparticles further improved the passivating and strengthening ability of Zn-MgO coating. Moreover, the XRD profile of the coatings possessed high intensities, which indicated that the coatings exhibit microstructural and chemical homogeneity, high stability and good texture. It was observed on the SEM micrographs that the Zn-MgO-UPP coating exhibited a more refined microstructure compared to the Zn-MgO coating, indicating the grain refining tendency of the UPP nanoparticles. The EDS further indicated the presence of essential and dispersion strengthening elements in the coatings.

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Bond shear strength of Al2O3 nanoparticles reinforced 2220-capacitor/SAC305 solder interconnects reflowed on bare and Ni-coated copper substrate

Cited by 7 publications

References 56 publications

A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process

A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process

Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review

Exploration of the effect of Zn-MgO-UPP coating on hardness, corrosion resistance and microstructure properties of mild steel

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