Bond‐Strength Measurements Related to Silicon Surface Hydrophilicity

Bäcklund, Ylva; Hermansson, Karin; Smith, Leif

doi:10.1149/1.2221218

Cited by 66 publications

(42 citation statements)

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“…5 Hydrophilicity and hydrophobicity are related to the existence of certain surface chemical species. 34,35 The origin of hydrophilicity is attributed to singular and associated hydroxyl groups on the GaP and GaAs surfaces, while the hydrophobic surfaces on acid-͑HF-and HCl-͒ treated surfaces may be mainly characterized by the H-͑Cl-͒ terminated surfaces. In IIIϪV semiconductors, the concentrated HCl solution is well known to produce stable, Cl-terminated surfaces.…”

Section: Wettabilitymentioning

confidence: 99%

Properties of GaP(001) surfaces treated in aqueous HF solutions

Morota

Adachi

2007

Journal of Applied Physics

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Chemically cleaned GaP͑001͒ surfaces in aqueous HF solutions have been studied using spectroscopic ellipsometry ͑SE͒, ex situ atomic force microscopy ͑AFM͒, x-ray photoelectron spectroscopy ͑XPS͒, wettability, and photoluminescence ͑PL͒ measurements. The SE data clearly indicate that the solutions cause removal of the native oxide film immediately upon immersing the sample ͑Յ1 min͒. The SE data, however, suggest that the native oxide film cannot be completely etch-removed. This is due to the fact that as soon as the etched sample is exposed to air, the oxide starts to regrow. The SE estimated roughness is ϳ1 nm, while the AFM roughness value is ϳ0.3 nm. The XPS spectra confirm the removal of the native oxide and also the presence of regrown oxide on the HF-etched GaP surface. The wettability measurements indicate that the HF-cleaned surface is hydrophobic, which is in direct contrast to those obtained from alkaline-cleaned surfaces ͑hydrophilic͒. A slight increase in the PL intensity is also observed after etching in aqueous HF solutions.

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Section: Wettabilitymentioning

confidence: 99%

Properties of GaP(001) surfaces treated in aqueous HF solutions

Morota

Adachi

2007

Journal of Applied Physics

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“…[2][3][4][5][6]47,48 A straightforward method to determine wettability is to measure the contact angle of a drop of water on the surface. 49 If the wettability is high, the contact angle will be small and the surface is hydrophilic. On the contrary, if the wettability is low, will be large and the surface is hydrophobic.…”

Section: Wettabilitymentioning

confidence: 99%

“…49,53 The origin of hydrophilicity can be attributed to singular and associated hydroxyl groups on the GaP and GaAs surfaces, while the hydrophobic surfaces on acid ͑HCl and HF͒ treated surfaces may be mainly characterized by the Cl ͑H͒-terminated surfaces. It is well known that the concentrated HCl solutions produce stable, Cl-terminated III-V semiconductor surfaces ͑see Ref.…”

Section: Wettabilitymentioning

confidence: 99%

Properties of GaP(001) surfaces chemically treated in NH4OH solution

Morota

Adachi

2006

Journal of Applied Physics

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Chemically cleaned GaP͑001͒ surfaces in 25% NH 4 OH solution have been studied using spectroscopic ellipsometry ͑SE͒, ex situ atomic force microscopy ͑AFM͒, x-ray photoelectron spectroscopy ͑XPS͒, and wettability measurement techniques. The SE data clearly indicate that the solution causes removal of the native oxide film immediately upon immersing the sample. The SE data also indicate that when the native oxide film is completely etch removed, the resulting surface is still roughened. The estimated roughness thickness is ϳ1.2 nm, in excellent agreement with the AFM rms value ͑ϳ1.2 nm͒. The XPS spectra confirm the removal of the native oxide from the GaP surface. The XPS data also suggest a thin oxide overlayer, ϳ0.3 nm thick, on the etch-cleaned GaP surface. The wettability measurements indicate that the as-degreased surface is hydrophobic, while the NH 4 OH-cleaned surface is hydrophilic. This result is in direct contrast to those obtained from acid cleaned surfaces, which are usually hydrophobic. The origin of hydrophilicity may be singular and associated hydroxyl groups bonded on the GaP surface.

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“…The bonding setup consisted of a hotplate and a pair of aluminum plates connected to a voltage supply. The individual parts were cleaned utilizing RCA-I and RCA-II techniques prior to the bonding process [32,33]. This removed any organic and inorganic contaminations attached to the bonding surface.…”

Section: Fabricationmentioning

confidence: 99%

Experimental and computational investigation of a MEMS-based boiler for waste heat recovery

Thapa

Borquist

Baniya

et al. 2015

Energy Conversion and Management

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a b s t r a c tThermodynamically limited processes make waste heat abundant in availability. An Organic Rankine Cycle (ORC) steam powered micro system designed to scavenge waste heat from various sources (transportation, industries or solar) is presented. The key boiler component is fabricated and characterized in this work. The system design has been inspired by the various efforts implemented in development of micro heat recovery devices and engines. The complete system consists of three individual micro components (1) boiler, (2) free piston expander and (3) superheater. Specifically, design, fabrication techniques, test setup and results of the miniaturized boiler are presented in this paper. A key design feature of the boiler is the inclusion of capillary channels for fluid flow from the surrounding reservoirs to the heated area. The pressurized steam is created by the boiler as a result of phase transformation of the working fluid. This pressurized steam can be utilized to drive another MEMS device (PZT membranes, turbines, thermoelectric, etc.) to generate power. In this upgraded boiler design, radial capillary channels and a thin film glass steamdome were considered to improve the operating efficiency. These inclusions enhanced capillary flow, energy absorption via phase change, mass flow rate and operating pressure. The power inputs of 1.8 W and 2.7 W were selected to simulate and characterize the boiler performance based on real-world waste heat source temperatures. For these power inputs, the maximum power absorption efficiency demonstrated by the boiler via phase change of the working fluid was approximately 88%. The peak operating pressure demonstrated by the boiler was 8.5 kPa. These thermally efficient characteristics of the boiler make it a potential future device for waste heat scavenging.

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Bond‐Strength Measurements Related to Silicon Surface Hydrophilicity

Cited by 66 publications

References 0 publications

Properties of GaP(001) surfaces treated in aqueous HF solutions

Properties of GaP(001) surfaces treated in aqueous HF solutions

Properties of GaP(001) surfaces chemically treated in NH4OH solution

Experimental and computational investigation of a MEMS-based boiler for waste heat recovery

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