Bond strength of conductive Si-Si fusion bonded seals

Schjølberg-Henriksen, Kari; Tvedt, Lars Geir Whist; Moe, Sigurd; Poppe, Erik; Wang, Dag; Gjelstad, Stein Are; MØrk, Christopher; Imenes, Kristin

doi:10.1109/dtip.2014.7056638

Cited by 3 publications

(4 citation statements)

References 6 publications

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“…Implanted wafers bonded equally well as nonimplanted wafers, indicating that boron implantation did not significantly impede SDWB. This indication is further supported by the fact that bond strength measurements did not show any significant difference between implanted wafers, non-implanted wafers, and wafers with an intentional 60 nm thick SiO 2 at the bond interface (Schjølberg-Henriksen et al 2014).…”

Section: Discussionsupporting

confidence: 63%

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Conductivity of high-temperature annealed silicon direct wafer bonds

et al. 2015

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Section: Discussionsupporting

confidence: 63%

“…The bond strength was measured by pull testing of bonded dies. The bond strength results have been presented by Schjølberg-Henriksen et al (2014).…”

Section: Methodsmentioning

confidence: 99%

Conductivity of high-temperature annealed silicon direct wafer bonds

et al. 2015

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“…MIP seals offer superior sealing performance by reducing leak paths. They also offer enhanced environmental resistance as contaminants have no gaps to enter [42,43]. One of the significant advantages of MIP seals over conventional seals is their increased design flexibility, as they can conform to complex geometries.…”

Section: Direct Printing Of Molded-in-place (Mip) Sealsmentioning

confidence: 99%

“…One of the significant advantages of MIP seals over conventional seals is their increased design flexibility, as they can conform to complex geometries. MIP seals find their application in numerous industries, such as automotive, aerospace, semiconductor, and consumer electronics [42,43]. MIP seals with FKM rubber as the sealing material are commonly used in the abovementioned industries where the seal needs to withstand high-pressure and high-temperature environments.…”

Section: Direct Printing Of Molded-in-place (Mip) Sealsmentioning

confidence: 99%

From Formulation to Application: Effects of Plasticizer on the Printability of Fluoro Elastomer Compounds and Additive Manufacturing of Specialized Seals

Periyasamy,

Mubasshir,

Kodra

et al. 2024

Micromachines

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This work investigated material extrusion additive manufacturing (MatEx AM) of specialized fluoroelastomer (FKM) compounds for applications in rubber seals and gaskets. The influence of a commercially available perfluoropolyether (PFPE) plasticizer on the printability of a control FKM rubber compound was studied using a custom-designed ram material extruder, Additive Ram Material Extruder (ARME), for printing fully compounded thermoset elastomers. The plasticizer’s effectiveness was assessed based on its ability to address challenges such as high compound viscosity and post-print shrinkage, as well as its impact on interlayer adhesion. The addition of the PFPE plasticizer significantly reduced the FKM compound’s viscosity (by 70%) and post-print shrinkage (by 65%). While the addition of the plasticizer decreased the tensile strength of the control compound, specimens printed with the plasticized FKM retained 34% of the tensile strength of compression-molded samples, compared to only 23% for the unplasticized compound. Finally, the feasibility of seals and gaskets manufacturing using both conventional and unconventional additive manufacturing (AM) approaches was explored. A hybrid method combining AM and soft tooling for compression molding emerged as the optimal method for seal and gasket fabrication.

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