2011 IEEE 13th Electronics Packaging Technology Conference 2011
DOI: 10.1109/eptc.2011.6184377
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Bondability of copper wires on PPF leadframe

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“…It is believed that thicker AuAg layer provided higher cushioning effect during PCC wire bonding thus reduced wire deformation at heel. A thicker but softer AuAg layer made the PCC wire more bondable with the hard Ni-plated Cu lead frame [15]. Fig.…”
mentioning
confidence: 99%
“…It is believed that thicker AuAg layer provided higher cushioning effect during PCC wire bonding thus reduced wire deformation at heel. A thicker but softer AuAg layer made the PCC wire more bondable with the hard Ni-plated Cu lead frame [15]. Fig.…”
mentioning
confidence: 99%