“…It is believed that thicker AuAg layer provided higher cushioning effect during PCC wire bonding thus reduced wire deformation at heel. A thicker but softer AuAg layer made the PCC wire more bondable with the hard Ni-plated Cu lead frame [15]. Fig.…”
“…It is believed that thicker AuAg layer provided higher cushioning effect during PCC wire bonding thus reduced wire deformation at heel. A thicker but softer AuAg layer made the PCC wire more bondable with the hard Ni-plated Cu lead frame [15]. Fig.…”
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