Bondability of Gold Wire to Gold-Plated Electrodes

Haji, Hiroshi; Morita, Toshiaki; Arita, Kiyoshi; Nakashima, Hideharu; Yoshinaga, Hideo

doi:10.2320/matertrans1989.34.960

Cited by 10 publications

(3 citation statements)

References 5 publications

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“…It was difficult to produce a thick Au layer using the immersion method because the reaction stopped when the Ni surface (base metal) was substituted by Au (noble metal). 10,11 A thicker Au layer was produced using electrolytic plating over immersion Au (sample 6) for comparison with that produced purely by the immersion method (sample 5). For samples 1-4, a solder mask was applied after plating, while for samples 5 and 6, the solder mask was applied before plating.…”

Section: Bond-pad Preparationmentioning

confidence: 99%

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Process windows for low-temperature Au wire bonding

Chan

Kim

Liu

et al. 2004

Journal of Elec Materi

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The process windows are presented for low-temperature Au wire bonding on Au/Ni/Cu bond pads of varying Au-layer thicknesses metallized on an organic FR-4 printed circuit board (PCB). Three different plating techniques were used to deposit the Au layers: electrolytic plating, immersion plating, and immersion plating followed by electrolytic plating. Wide ranges of wire bond force, bond power, and bond-pad temperature were used to identify the combination of these processing parameters that can produce good wire bonds, allowing the construction of process windows. The criterion for successful bonds is no peel off for all 20 wires tested. The wire pull strengths and wire deformation ratios are measured to evaluate the bond quality after a successful wire bond. Elemental and surface characterization techniques were used to evaluate the bond-pad surfaces and are correlated to wire bondability and wire pull strength. Based on the process windows along with the pull strength data, the bond-pad metallization and bonding conditions can be further optimized for improved wire bondability and product yields. The wire bondability of the electrolytic bond pad increased with Au-layer thickness. The bond pad with an Au-layer thickness of 0.7 µm displayed the highest bondability for all bonding conditions used. The bondability of immersion bond pads was comparable to electrolytic bond pads with a similar Au thickness. Although a high temperature was beneficial to wire bondability with a wide process window, it did not improve the bond quality as measured by wire pull strength.

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Section: Bond-pad Preparationmentioning

confidence: 99%

“…This reduces the frictional energy arising from the vibration of wire against the bond pad, which is detrimental to wire bondability and bond yield. 3,10 The hardness measured from the nanoindentation test is plotted as a function of Au thickness, as shown in Fig. 9.…”

Section: Surface Characteristics Of the Bond Padsmentioning

confidence: 99%

Process windows for low-temperature Au wire bonding

Chan

Kim

Liu

et al. 2004

Journal of Elec Materi

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“…The XPS result also suggests that the four different plasma treatment schemes were effective in removing almost all Ni content on the top Au layer surface. The Ni impurity in the form of nickel oxide on the bond pad is harmful to wire bond strength [24].…”

Section: A Optimization Of Plasma Treatment Conditionmentioning

confidence: 99%

Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding

Chan

Kim

Liu

et al. 2005

IEEE Trans. Adv. Packag.

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The wire bondability of Au-Ni-Cu bond pads with different Au plating schemes, including electrolytic and immersion plates, are evaluated after plasma treatment. The plasma cleaning conditions, such as cleaning power and time, are optimized based on the process window and wire pull strength measurements for different bond pad temperatures. Difference in the efficiency of plasma treatment in improving the wire bondability for different Au plates is identified. The plasma-cleaned bond pads are exposed to air to evaluate the recontamination process and the corresponding degradation of wire pull strength. The changes in bond pad surface characteristics, such as surface free energy and polar functionality, with exposure time are correlated to the wire pull strength, which in turn provides practical information about the shelf life of wire bonding after plasma clenaning.Index Terms-Au-Ni-Cu bond pad, Au wire bond, plasma treatment, process window, surface energy.

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Effects of metallization characteristics on gold wire bondability of organic printed circuit boards

Kim

2001

J. Electron. Mater.

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Bondability of Gold Wire to Gold-Plated Electrodes

Cited by 10 publications

References 5 publications

Process windows for low-temperature Au wire bonding

Process windows for low-temperature Au wire bonding

Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding

Effects of metallization characteristics on gold wire bondability of organic printed circuit boards

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