Bonding mechanism and mechanical properties of 2196 Al-Cu-Li alloy joined by hot compression deformation

Xu, Xiang; Ma, Xiang; Yu, Shubin; Zhao, Guoqun; Wang, Yong-Xiao; Chen, Xiaoxue

doi:10.1016/j.matchar.2020.110486

Cited by 35 publications

(8 citation statements)

References 47 publications

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“…To quantify the influence of the thermo-mechanical fields on the bonding conditions, the scalar bonding quality criterion used in [18] was utilized, as follows:…”

Section: Macro Imagementioning

confidence: 99%

“…The bonding quality is assumed to increase for greater values of J, with some critical value J cr denoting full metallurgical bonding. Unlike the study in [18], which utilized the average values from the experiment, in the current study, the local values of J were evaluated using the computed time-dependent mechanical fields values. Average values of J in each of the regions of interest, shown in Figure 8, were computed (J was calculated in differential form at five nodal points in the FE model, sampling each area).…”

Section: Macro Imagementioning

confidence: 99%

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Bonding of Al6061 by Hot Compression Forming: A Computational and Experimental Study of Interface Conditions at Bonded Surfaces

Mittelman

Ben-Haroush²,

Aloush

et al. 2021

Materials

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In recent years, there has been a growing interest in composite components, which may be designed to provide enhanced mechanical and physical effective properties. One of the methods available to produce such components is joining by plastic deformation, which results in metallurgical bonding at the interface. However, the portions of the interface that are bonded and the inhomogeneity in the bonding strength achieved at the interface tend to be overlooked. In the present study, Al6061 beams were bonded, by hot compression (300–500 °C) to different degrees of reduction. The compression was followed by tensile debonding experiments and the revealed interface was microscopically characterized in order to determine the areas that were metallurgically bonded. The SEM characterization revealed that the actual bonded area is much smaller than the interface contact area. Thermo-mechanical finite element models of the compression stage were used to investigate the thermo-mechanical fields, which develop along the interface and influence the resulting bonding strength. The principal strain field patterns across the interface area were shown to be similar to the experimentally observed temperature-dependent bonding patterns. In addition, a quantitative criterion for bonding quality was implemented and shown to correlate with the experimental findings.

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“…To quantify the influence of the thermo-mechanical fields on the bonding conditions, the scalar bonding quality criterion used in [18] was utilized, as follows:…”

Section: Macro Imagementioning

confidence: 99%

Section: Macro Imagementioning

confidence: 99%

Bonding of Al6061 by Hot Compression Forming: A Computational and Experimental Study of Interface Conditions at Bonded Surfaces

Mittelman

Ben-Haroush²,

Aloush

et al. 2021

Materials

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show abstract

“…In this study, the bonding process of bimetals is more similar to that of hot compression bonding technology. 17–21 Xie et al 22,23 studied the interface healing mechanism of the hot compression bonding 316LN stainless steel joint and pointed out that the dissolution of oxides at the interface at a higher holding temperature could promote the interface bonding. Sun et al 24 used hot-compression bonding technology to manufacture blanks with uniform composition and carried out a series of hot working on the blank to manufacture an integral support ring (φ15.6 m).…”

Section: Introductionmentioning

confidence: 99%

“…In this study, the bonding process of bimetals is more similar to that of hot compression bonding technology. [17][18][19][20][21] Xie et al 22,23 studied the interface healing mechanism of the hot compression bonding 316LN stainless steel joint and pointed out that the dissolution of oxides at the interface Shanxi Key Laboratory of Metal Forming Theory and Technology, Taiyuan University of Science and Technology, Taiyuan, People's Republic of China Corresponding author: Zhenjiang Li, Shanxi Key Laboratory of Metal Forming Theory and Technology, Taiyuan University of Science and Technology, Taiyuan 030024, Shanxi, People's Republic of China. Email: lizj@tyust.edu.cn at a higher holding temperature could promote the interface bonding.…”

Section: Introductionmentioning

confidence: 99%

A study on hot deformation behavior of 40Cr/Q345B bimetal

Yuan

Zhang

et al. 2023

Proceedings of the Institution of Mechanical Engineers, Part L:

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The hot deformation behavior of 40Cr/Q345B bimetal during hot compression bonding was studied using the isothermal compression method. A true stress–strain curve of the bimetal was obtained and modified to eliminate the effects of friction. The results show that the flow stress increases with decreasing deformation temperature and increasing strain rate. By analyzing the relationship of stress, deformation temperature, and strain rate, the constitutive equation of 40Cr/Q345B bimetal was obtained. The hot processing maps of 40Cr/Q345B bimetal under different strains are drawn. Through microstructure characterization, 40Cr/Q345B bimetal formed metallurgical bonding under the deformation process of this study. Combined with the hot processing map, microstructure, prior austenite grain, and microhardness distribution, it is proposed that the optimal deformation parameters of 40Cr/Q345B bimetal is 1050–1150°C and 0.02–0.4 s−1.

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“…It is well known that severe plastic deformation results in dynamic recrystallization (DRX) of microstructures [15]. For this reason, many studies have investigated the development of dynamic recrystallized (DRXed) grains during solid state bonding processes with large deformation [16,17]. Unlike in bonding with very small deformation, DRXed grains play an important role in bonding with large deformation.…”

Section: Introductionmentioning

confidence: 99%

Interfacial Microstructure Analysis of AZ31 Magnesium Alloy during Plastic Deformation Bonding

Ren

Chen

et al. 2021

Processes

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In this study, a plastic deformation process consisting of hot compression at 350 °C and heat treatment at 400 °C was performed to bond AZ31 magnesium alloy. Microstructural evolution around the bonding interface was systematically characterized to investigate the bonding process and clarify the bonding mechanism. When the plastic deformation strain reached 0.6, the bonding zone was full of fine dynamic recrystallized grains and the initial interface was eliminated. The post-heating treatments were conducted to achieve a sound interface bonding. The tensile tests and the corresponding fracture morphologies analysis indicated that the optimum holding time of heat treatment was 8 h. The interfacial bonding strength of the specimens holding for 8 h reached 164.7 MPa, an enhancement of about 9% compared with that of the specimens holding for 1 h. The microstructure analysis indicated that the bonding quality was affected by migration of the interfacial grain boundary (GB), the development of recrystallized grains and the evolution of interfacial oxides around the bonding area.

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Bonding mechanism and mechanical properties of 2196 Al-Cu-Li alloy joined by hot compression deformation

Cited by 35 publications

References 47 publications

Bonding of Al6061 by Hot Compression Forming: A Computational and Experimental Study of Interface Conditions at Bonded Surfaces

Bonding of Al6061 by Hot Compression Forming: A Computational and Experimental Study of Interface Conditions at Bonded Surfaces

A study on hot deformation behavior of 40Cr/Q345B bimetal

Interfacial Microstructure Analysis of AZ31 Magnesium Alloy during Plastic Deformation Bonding

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