Bonding mechanism of laser joining of Poly-Ether-Ether-Ketone film which used for 5G antenna substrate to copper foil

Hao, Ruijie; Zhao, Yixuan; Su, Jianhui; Yang, Jin; Tan, Caiwang; Song, Xiaoguo

doi:10.1016/j.jmapro.2023.11.005

Cited by 7 publications

(1 citation statement)

References 35 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Furthermore, in tandem with advancements in foldable and curable display technologies, FCCL have found extensive application in producing flexible display screens, including foldable cell phones and curling e-readers. These laminates possess the remarkable ability to bend significantly without compromising electronic components, offering users a more portable and adaptable display solution, which have attracted extensive research attention [1][2][3][4][5][6]. FCCL consists of a flexible polymer substrate and a conductive metal film.…”

Section: Introductionmentioning

confidence: 99%

Adhesion improvement of sputtered Cu films on flexible polymer substrates through the design of metal interlayers

Wang,

Wang

et al. 2024

Phys. Scr.

View full text Add to dashboard Cite

Magnetron sputtering is an alternative approach to prepare flexible copper clad laminates because of low cost and thin copper clad laminate thickness. However, Cu film has poor adhesion when directly deposited on polymer substrates, imposing certain limits to the use of magnetron sputtering technique. In this work, Cu film was deposited on polymer substrates including polyimide, polyethylene terephthalate and polytetrafluoroethylene. Different metal interlayers were introduced into the polymer/Cu interfaces to improve the adhesion between polymer substrates and Cu film. It was found that the metal interlayer could significantly improve the adhesion strength of Cu film to polymers and a reasonably rough polymer surface could also enhance the mechanical bonding with Cu film. A metal Ni interlayer provides the best adhesion enhancement, which is associated with the same crystal structure between Ni and Cu as well as their excellent solid solubility. Meanwhile, a metal interlayer also contributes to Cu (111) orientation growing during deposition. This proposes a promising route to overcome the wear adhesion problem between Cu film and polymers in the preparation of magnetron sputtered flexible copper clad laminates.

show abstract