Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications

Fabrication of Cu@Sn TLPS joint for high temperature power electronics application

“…In the second stage, the nucleation and growth of Cu 3 Sn are based on the consumption of Cu 6 Sn 5 phase and the diffusion of Cu atoms, and the activation energy is 113.46 kJ mol −1 . 21 In the process of Cu@Sn TLPS, the activation energy of Cu 3 Sn growth is 50 kJ mol −1 .…”

“…The shear strength of Cu@Sn samples reflowing at 280 °C for 40 min and aging at 400 °C for 1000 h are 48.9 and 44.6 MPa, respectively, which is higher than that of the similar system, for Cu@Sn@Ag system, 22 the average shear strengths of the bondline were 25.8 and 19.7 MPa at 30 and 400 °C, respectively. For Sn-coated Cu micro paste system, 23 the TLPS-bonded joints exhibit relatively high shear strength values of ∼40 MPa. Compared with the commonly used as high temperature resistant soldering materials for high power electronic devices—high Pb alloy 24 and sintered nano-Ag, 25 the Cu@Sn TLPS joint in our work also attains higher shear strength, as shown in Fig.…”

A Mini Review on the Microvia Filling Technology Based on Printed Metal Nano/Microparticles

“…Some studies attempted to coat the Cu particles with organic protective agents such as polyvinyl pyrrolidone (Sampath et al, 2014), gelatin, ethanolamine, andoleylamine (Ben Aissa et al, 2015). Some researchers attempted to replace Ag/Cu particles with other conductive particles, such as Sn-coated Cu particles (Kang et al, 1998;Yoon et al, 2020) and Ag-coated Cu particles (Yu et al, 2017;Yang et al, 2021c). Due to the low melting point of Sn, the Sn-coated Cu particles can be sintered at lower temperature.…”

Recent Development of Joining and Conductive Materials for Electronic Components

“…This process has the disadvantage of a long treatment time since TLP is diffusion joining. Therefore, to realize the formation of an intermetallic compound in the joint in a short time, a method for mixing Cu particles, 107109) Ag particles, 110112) Ni particles, 113115) In particles 112,116) and CuZnAl particles 104) with Sn-based solder powder or paste, and the application of Sn-coated Cu particles 117) have been reported.…”