Joining and Assembly of Medical Materials and Devices 2013
DOI: 10.1533/9780857096425.3.370
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Bonding strategies and adhesives for joining medical device components

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Cited by 5 publications
(5 citation statements)
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“…Some researchers discovered that the main elements of these alterations were low-weight oxidized products such as organic acids with one or two carboxylic acid groups, and occasionally even vinyl or hydroxyl functionalities [20,21]. However, synthetic polymer processing aids, unreacted monomers, waxes, and other mobile components can diffuse to surfaces [22]. Simultaneously, the hydrophobic sections of a polymer chain can reorient to the polymer surface, to lower surface energy.…”
Section: Hydrophilicity and Hydrophobic Recoverymentioning
confidence: 99%
“…Some researchers discovered that the main elements of these alterations were low-weight oxidized products such as organic acids with one or two carboxylic acid groups, and occasionally even vinyl or hydroxyl functionalities [20,21]. However, synthetic polymer processing aids, unreacted monomers, waxes, and other mobile components can diffuse to surfaces [22]. Simultaneously, the hydrophobic sections of a polymer chain can reorient to the polymer surface, to lower surface energy.…”
Section: Hydrophilicity and Hydrophobic Recoverymentioning
confidence: 99%
“…Some of the common applications of jetting include underfilling of electronic packages, surface mount adhesives for bonding of components, encapsulation of components, UV conformal coating, etc. In medical device assembly, coating of critical components is a common application to protect from fluid ingress and environmental conditions that can impact electrical performance of the device [12].…”
Section: Microelectronicsmentioning
confidence: 99%
“…7 indicates epoxy deposition using a jetting process to bond batteries, electronic modules and other critical components in position used in the pacemaker. In addition to bonding, the adhesive also provides thermal resistance to withstand high temperatures [12]. Droplet size of approximately 200 microns with keep out zones less than 100 microns is required from the jetting process to provide high quality dispensed patterns.…”
Section: Microelectronicsmentioning
confidence: 99%
“…Neat polymers with polar bonds or conductive polymers may also show an RF heating response because of the vibration and energy dissipation by the dipole/ionic structure present in the molecule. A study by Chaffin et al has used RF heating of neat polymeric adhesives such as epoxy, urethane, phenolic, and acrylic for welding of automotive parts and medical components . Wu and Benatar carried out a similar study where microwave heating of conductive polyaniline coatings was used for the welding of two polyethylene specimens …”
Section: Introductionmentioning
confidence: 99%
“…A study by Chaffin et al has used RF heating of neat polymeric adhesives such as epoxy, urethane, phenolic, and acrylic for welding of automotive parts and medical components. 19 Wu and Benatar carried out a similar study where microwave heating of conductive polyaniline coatings was used for the welding of two polyethylene specimens. 20 In this study, we report our surprising findings on the RF heating behavior of PAN fibers and films.…”
Section: Introductionmentioning
confidence: 99%