Bonding Strengths and Thermal Degradation of Photovoltaic Module Ribbon Solder Joints

Kang, Min-Soo; Jeon, Yong-Sung; Shin, Young-Eui

doi:10.1007/s40684-019-00045-0

Int. J. of Precis. Eng. and Manuf.-Green Tech.

2019

DOI: 10.1007/s40684-019-00045-0

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Bonding Strengths and Thermal Degradation of Photovoltaic Module Ribbon Solder Joints

Min-Soo Kang

Yong-Sung Jeon

Young-Eui Shin

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2024

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Study on the degradation of welding strength in ceramic substrates subjected to temperature cycling

Yue,

Wang,

Liu

et al. 2024

J. Phys.: Conf. Ser.

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This article uses AlN and Al2O3 thick film substrates to conduct an in-depth study of the attenuation of welding strength of ceramic substrates under temperature cycling conditions. Using the test method of miniaturizing the substrate to test the transverse shear force, the shear force changes of different substrates with different 62Sn36Pb2Ag solder thicknesses were summarized and compared with the temperature cycle process. The finite element simulation method was used to simulate the Ag/SnPb interface, and the trend of interface stress and strain changing with temperature was obtained. Finally, the study found that during the temperature cycle, the Sn-enriched phase in the solder of the AlN substrate diffuses faster into the Ag layer, so the soldering strength of the AlN substrate decays faster during the temperature cycle.

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Study on the degradation of welding strength in ceramic substrates subjected to temperature cycling

Yue,

Wang,

Liu

et al. 2024

J. Phys.: Conf. Ser.

View full text Add to dashboard Cite

show abstract

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Bonding Strengths and Thermal Degradation of Photovoltaic Module Ribbon Solder Joints

Cited by 1 publication

References 28 publications

Study on the degradation of welding strength in ceramic substrates subjected to temperature cycling

Study on the degradation of welding strength in ceramic substrates subjected to temperature cycling

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