Boron nitride‐graphene sponge as skeleton filled with epoxy resin for enhancing thermal conductivity and electrical insulation

Abstract

3D Graphene sponge (GS) supported boron nitride (BN) skeleton (BN@GS) was fabricated through a facile method by using ammonium sulfide under mild conditions. Then, BN@GS sponge was infiltrated by epoxy resin to prepare the composites. The microstructures of BN@GS were controlled by adjusting the mass ratio of GS to BN and the dimension of BN to obtain thermally conductive but electrically insulating polymer composites. The thermal and electrical properties of composites were investigated and the results showed that thermal conductivity of composites reached 0.588 W m−1 K−1 at a low GS loading of 0.157 wt%, which was twice as large as the BN/epoxy composites without graphene. When the mass ratio of BN to GS was 60:1 and 100:1, the electrical conductivity of the resin composites corresponded to insulator region. The 3D continuous network of GS endowed the composites with enhanced thermal conductivity at a relatively low filler loading. In addition, the introduction of BN cut off the transmission of electrons which resulted in the composites with electrical insulation. The hybrid fillers were introduced to guarantee the enhanced thermal conductivity and electrical insulation at a relatively low filler loading. The thermal conductivity of the BN@GS/epoxy composites coincide well with the surface temperature variation of the BN@GS/epoxy composites acquired from an infrared camera. The mechanical properties of BN@GS/epoxy composites improved remarkably in comparison with pure epoxy resin. POLYM. COMPOS., 40:E1600–E1611, 2019. © 2019 Society of Plastics Engineers

Copper and graphene work together to construct a three‐dimensional skeleton thermal conductivity network to improve the thermal conductivity of the epoxy resin

“…[2][3][4][5] Therefore, the development of efficient heat dissipation materials has become an urgent need for the development of integrated circuits. [6][7][8] Polymer composites have attracted much attention because of their good performance, [9][10][11][12][13] including light weight, easy to process and other advantages, but the thermal conductivity of most polymers themselves is not high, only 0.1-0.3 W m À1 K À1 , which cannot meet the heat dissipation requirements of electronic devices. [14][15][16] Therefore, polymer matrix is usually filled with high thermal conductivity fillers to obtain composite materials with high thermal conductivity, and high thermal conductivity fillers is the most important thing to prepare high thermal conductivity polymer composites.…”

Efficient Preconstruction of Three-Dimensional Graphene Networks for Thermally Conductive Polymer Composites

“…Although pure graphene networks have great potentials in forming thermally conductive pathways for polymer composites, their low density and relatively weak sheet interconnections would inevitably hinder the further improvement in thermal conductivity of their polymer composites. Thus, functional additives, especially commercially available thermally conductive materials, such as GNPs [ 9 , 77 , 228 ], boron nitride (BN) nanoplatelets [ 229 – 231 ], carbon nanotubes (CNTs) [ 62 , 232 ], carbon fibers [ 233 ], cellulose nanocrystals [ 234 ], copper nanowires [ 235 ], and silicon carbide nanowires [ 236 ], are usually incorporated into the graphene networks to obtain hybrid graphene networks for enhancing the structural robustness and thermally conductive properties.…”

Effect of Temperature on the Charge Transport Behavior of Epoxy/Nano−SiO2/Micro−BN Composite

“…Additionally, the thermal conductivity of epoxy resin is only about 0.2 W/(m·K), which seriously affects the heat dissipation performance of the device. Some studies have shown that doping a certain amount of thermal conductive fillers in polymers can improve the thermal properties but adding too much filler will cause poor dielectric properties of the materials [ 12 , 13 ]. Therefore, developing new composite insulation materials which offer excellent thermal conductivity but low electrical conductivity has attracted significant interest worldwide [ 14 , 15 ].…”