Area-selective
deposition (ASD) of polymers is expected to be useful
for self-aligned patterning of nucleation inhibitors, sacrificial
layers, and air-gap materials during future bottom-up nanoscale materials
fabrication. This work describes a simple, rapid, and effective method
to achieve inherent ASD of poly(3,4-ethylenedioxythiophene) (PEDOT)
on SiO2 vs hydrogen-terminated silicon (Si-H) substrates
via molecular layer deposition (MLD) and chemical vapor deposition
(CVD) using 3,4-ethylenedioxythiophene (EDOT) as a reactive monomer
and SbCl5 as an oxidant for polymerization. Film thickness
measured by spectroscopic ellipsometry indicates the MLD process can
obtain ∼35 nm of deposition with a selectivity of 90%, i.e., t
S=0.90 ≈ 35 nm, which
is better than many other reports of inorganic or organic material
ASD. Furthermore, we show that under CVD conditions, the selectivity
is further improved, i.e., t
S=0.90 ≈ 55.4 nm and that CVD can achieve ASD at an overall
rate more than 100 times faster than MLD for the same ASD thickness,
allowing 30 nm of ASD to be achieved in less than 10 s of process
time. The selective growth of PEDOT on SiO2 vs Si-H is
ascribed to the localized reduction of the SbCl5 on the
Si-H surface, thereby inhibiting EDOT polymerization in that region.
The high selectivity allows us to observe and analyze lateral “mushroom”
overgrowth and compare ASD growth rates on blanket vs patterned wafers.
Overall, results suggest that CVD may have distinct advantages over
MLD or atomic layer deposition (ALD) for other ASD applications.