Bound-abrasive grinding and polishing of surfaces of optical materials

Filatov, Yuriy D.

doi:10.1117/1.3584837

Cited by 24 publications

(7 citation statements)

References 7 publications

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“…As well as for any brittle nonmetallic material, the diamond grinding of ceramic products, in particular from silicon carbide, is radically different from the abrasive grinding of metals [7][8][9]. When the diamond grinding brittle nonmetallic materials, there are an elastic-plastic deformation without breaking, as well dispersing the machining allowance at plastic deformation and brittle breaking the material with particle chipping.…”

Section: Features Of Surface Layer Forming In Ceramic Products From Smentioning

confidence: 99%

Diamond Grinding the Ceramic Balls from Silicon Carbide

Сохань¹,

Maystrenko²,

Kulich³

et al. 2018

JES

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The influence of the machining regime was experimentally investigated on the output indexes of the diamond grinding the ceramic balls from silicon carbide, such as the rate of the material removal and the rate of changing (decreasing or increasing) the deviation from sphericity of the ball's surface. To distinguish a particle of these indexes as caused by the actual influence of the machining regime was applied a method of graphical approximation of the time-varying ball's diameter and deviation from sphericity. The separated particles of the process indexes can vary both as growing and as decreasing depending on the values of the parameters of the machining regime, such as: the discrete feeding of the diamond wheel to the cutting, the time of grinding between feedings of the wheel and the rotation speed of the table with the balls. For further determining the influence of the machining regime was applied a method of a complete factor-type experiment of type 2 3 , in which the factors of the above parameters were specified. As a result, the most effective way to reduce the deviation from the sphericity of the ball's surface is to combine these parameters. Keywords: ceramic balls from silicon carbide, diamond grinding, rate of the material removal, rate of changing the ball's shape, machining regime, discrete feeding of the diamond wheel to the cutting, time of grinding between feedings of the wheel, rotation speed of the table.

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Section: Features Of Surface Layer Forming In Ceramic Products From Smentioning

confidence: 99%

Diamond Grinding the Ceramic Balls from Silicon Carbide

Сохань¹,

Maystrenko²,

Kulich³

et al. 2018

JES

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“…It is based on a cluster model of frictional wear of solids and a physical statistical model of formation of debris particles and their removal from the workpiece surface [16][17][18][19][20]. The calculation of workpiece material removal rate Q in polishing involves the use of machining process parameters (the workpiece to pad contact pressure, the velocities of the workpiece and pad relative motions, the contact area between the workpiece and the polishing pad, the contact temperatures) and characteristics of the workpiece material and polishing pow der (the thermal conductivity coefficient of the workpiece material, the debris particle surface area, the mean size of polishing powder grains) and is carried out by the formula [1,3] …”

Section: Removal Rate In Polishing Monocrystalline Materialsmentioning

confidence: 99%

“…is the dimen sionless parameter; λ is the thermal conductivity coefficient of the workpiece material; T is the contact tem perature; p is the nominal workpiece to pad contact pressure; u is the velocity of the workpiece and pad rela tive motions [1,3,16,17,20]. The number of the ith debris particles on the surface area S i during the contact between the polishing grain and the workpiece surface t c = d/u was determined, in view of their distribution over the surface areas, by the formula ,…”

Section: Removal Rate In Polishing Monocrystalline Materialsmentioning

confidence: 99%

“…Based on the findings of computer modeling of the process of polishing sapphire planes with different ori entations, it has been found out that the removal rate grows with increasing the most probable size, surface area, and volume of debris particles (see Table 1) [16,17]. The dependence of the removal rate for the sapphire planes m, c, a, r on the debris particle surface area (Fig.…”

Section: Polishing Of Crystal Planes With Different Crystallographic mentioning

confidence: 99%

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Material removal rate in polishing anisotropic monocrystalline materials for optoelectronics

Filatov

Sidorko

Ковалев

et al. 2016

J. Superhard Mater.

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Based on investigations of the mechanism of precision surface formation in workpieces of anisotropic monocrystalline materials for optoelectronics, a generalized model of material removal in pol ishing with suspensions of polishing powders has been constructed. The removal rate in polishing sapphire planes of different crystallographic orientations has been found to grow in the series m < c < a < r with increasing volume, surface area, and most probable size of debris particles as well as with energy of disper sion of material from the face being polished.

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“…In addition, loose abrasive polishing requires an extremely large amount of slurry supplied continually, resulting in the cost increase not only for the cleaning of equipments and workpieces but also for the treatment of waste slurry. In order to reduce the time of polishing and decrease the supplying volume of slurry, considerable emphasis has been predominantly placed on two aspects: one is to thin the thickness of the damaged layer as possible by ductile mode grinding [2,3]; the other refers to raise the material removal rate in polishing process using fixed abrasive tool [4]. Especially, chemical fixed abrasive polishing technique has attracted attentions from many researchers as viewed from the polishing efficiency and surface quality.…”

Section: Introductionmentioning

confidence: 99%

Ultrafine Surface Finishing of Fused Silica Glass Using MCF (Magnetic Compound Fluid) Wheel

Guo

et al. 2012

AMR

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This paper aims to develop an alternative novel technique for the high efficiency and ultrafine surface finishing of fused silica glass. A semi-fixed abrasive tool named MCF (magnetic compound fluid) wheel is produced by distributing a certain volume of MCF slurry uniformly over the whole circumference surface of ring-shaped permanent magnets. An experimental rig is constructed in house followed by experimental investigations involving effects of the MCF wheel construction and process parameters on the material removal and work-surface roughness. As a result, the performance of the developed MCF wheel in the surface finishing of fused silica glass has been confirmed, and the appropriate wheel construction and process parameters have been determined in terms of the material removal rate, the flatness of polishing area and the surface roughness, showing an extremely smooth work-surface with surface roughness of Ra0.92nm has been achieved successfully in the current work.

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Bound-abrasive grinding and polishing of surfaces of optical materials

Abstract: International audienc

Cited by 24 publications

References 7 publications

Diamond Grinding the Ceramic Balls from Silicon Carbide

Diamond Grinding the Ceramic Balls from Silicon Carbide

Material removal rate in polishing anisotropic monocrystalline materials for optoelectronics

Ultrafine Surface Finishing of Fused Silica Glass Using MCF (Magnetic Compound Fluid) Wheel

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