Boundary-Scan Testing for Mixed — Signal MCMs

Kerkhoff, Hans G.; Boom, G. van den; Speek, H.

doi:10.1007/978-0-387-35311-1_42

VLSI: Integrated Systems on Silicon 1997

DOI: 10.1007/978-0-387-35311-1_42

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Boundary-Scan Testing for Mixed — Signal MCMs

Hans G. Kerkhoff

G. van den Boom

H. Speek

Abstract: A multi-chip module implementation is shown which provides new features and conditions for mixed-signal boundary-scan testing of MCMs. Assembled non boundary-scan mixed-signal bare dies and integrated passive devices can be tested using active-substrate Dff circuits. The MCM-D is very well suited for electronbeam diagnosis.

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Cited by 2 publications

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Testable Design and Testing of Microsystems

Kerkhoff¹

Design of Systems on a Chip: Design and Test

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http://www.ewh.ieee.org/tc/sensors/sensors2005/ Abstract:The market of microsystems, incorporating microelectronics with e.g. MEMS-based sensors and actuators increases rapidly. The often non-electrical sensors and actuators are notoriously difficult and/or expensive to test. As the entire micro system has to meet certain quality criteria for specific applications, new techniques are being developed.This tutorial will show current test practices of several basic categories of microsystems, and also methods to reduce or circumvent test problems. In these approaches, good knowledge on defects in the systems is required, and design modifications or extensions are shown to ease the testing process.

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Testable Design and Testing of Microsystems

Kerkhoff¹

Design of Systems on a Chip: Design and Test

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Test and Design-for-Test: from Circuits to Integrated Systems

Lubaszewski

Design of Systems on a Chip: Design and Test

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Boundary-Scan Testing for Mixed — Signal MCMs

Cited by 2 publications

References 11 publications

Testable Design and Testing of Microsystems

Testable Design and Testing of Microsystems

Test and Design-for-Test: from Circuits to Integrated Systems

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