Branched alumina filled epoxy resin and finite element simulation

Yao, Xiong; Wang, Xiaojian; Dong, Yanfang; Zhang, Rui; Zhang, Zhaoxian; Liang, Caihang

doi:10.1109/icept59018.2023.10492085

2023 24th International Conference on Electronic Packaging Technology (ICEPT) 2023

DOI: 10.1109/icept59018.2023.10492085

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Branched alumina filled epoxy resin and finite element simulation

Xiong Yao,

Xiaojian Wang,

Yanfang Dong

et al.

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Branched alumina filled epoxy resin and finite element simulation

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References 14 publications

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